Inventor · disambiguated record
Sangkwon Lee
Also filed as: LEE SANGKWON
10 granted patents·2 pending applications·19 citations·filing 2006–2019
84Inventor score
Files withSK HYNIX INC6STATS CHIPPAC LTD2LAMBOTTE GUILLAUME1LEE SANGKWON1MASSACHUSETTS INST TECHNOLOGY1
Top patents by PatentIndex Score
12 records- 0175US8030755B2Integrated circuit package system with a heat sinkSTATS CHIPPAC LTD·Filed 2006·Granted Oct 4, 2011·7 cites·20 claims
- 0275US7714451B2Semiconductor package system with thermal die bondingSTATS CHIPPAC LTD·Filed 2006·Granted May 11, 2010·6 cites·12 claims
- 0371US10706899B2Semiconductor deviceSK HYNIX INC·Filed 2019·Granted Jul 7, 2020·1 cites·5 claims
- 0469US10290361B2Semiconductor systemsSK HYNIX INC·Filed 2017·Granted May 14, 2019·2 cites·15 claims
- 0565US10497411B2Semiconductor deviceSK HYNIX INC·Filed 2019·Granted Dec 3, 2019·1 cites·7 claims
- 0663US10366732B2Semiconductor deviceSK HYNIX INC·Filed 2017·Granted Jul 30, 2019·1 cites·11 claims
- 0762US2020247670A1Sulfides Electrolyte for Metal Processing and ExtractionMASSACHUSETTS INST TECHNOLOGY·Filed 2019·Application pending·0 cites
- 0857US2019127221A1Sulfides electrolyte for metal processing and extractionLAMBOTTE GUILLAUME·Filed 2017·Application pending·0 cites
- 0955US8304922B2Semiconductor package system with thermal die bondingLEE SANGKWON·Filed 2010·Granted Nov 6, 2012·1 cites·7 claims
- 1049US8003497B2Diluted magnetic semiconductor nanowires exhibiting magnetoresistanceUNIV CALIFORNIA·Filed 2006·Granted Aug 23, 2011·0 cites·29 claims
- 1148US10811116B2Semiconductor systemsSK HYNIX INC·Filed 2019·Granted Oct 20, 2020·0 cites·12 claims
- 1245US10559340B2Semiconductor deviceSK HYNIX INC·Filed 2019·Granted Feb 11, 2020·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →