Inventor · disambiguated record
Sanjay Misra
Also filed as: MISRA SANJAY · MISRA SANJAY KUMAR
25 granted patents·8 pending applications·628 citations·filing 1998–2024
96Inventor score
Files withBERGQUIST CO12MAYO FOUND MEDICAL EDUCATION & RES5Henkel IP & Holding GmbH4JEWRAM RADESH2PETROLIAM NASIONAL BERHAD PETRONAS2
Top patents by PatentIndex Score
33 records- 0193US11547781B2Methods and materials for reducing venous neointimal hyperplasia of an arteriovenous fistula or graftMAYO FOUND MEDICAL EDUCATION & RES·Filed 2020·Granted Jan 10, 2023·2 cites·5 claims
- 0293US10286116B2Methods and materials for reducing venous neointimal hyperplasia of an arteriovenous fistula or graftMAYO FOUND MEDICAL EDUCATION & RES·Filed 2016·Granted May 14, 2019·5 cites·4 claims
- 0393US6197859B1Thermally conductive interface pads for electronic devicesBERGQUIST CO·Filed 1998·Granted Mar 6, 2001·104 cites·4 claims
- 0492US10722615B2Methods and materials for reducing venous neointimal hyperplasia of an arteriovenous fistula or graftMAYO FOUND MEDICAL EDUCATION & RES·Filed 2019·Granted Jul 28, 2020·3 cites·5 claims
- 0592US8110919B2Thermal interface with non-tacky surfaceJEWRAM RADESH·Filed 2010·Granted Feb 7, 2012·15 cites·9 claims
- 0691US6898084B2Thermal diffusion apparatusBERGQUIST CO·Filed 2003·Granted May 24, 2005·66 cites·9 claims
- 0791US6339120B1Method of preparing thermally conductive compounds by liquid metal bridged particle clustersBERGQUIST CO·Filed 2000·Granted Jan 15, 2002·59 cites·7 claims
- 0891US6165612AThermally conductive interface layersBERGQUIST CO·Filed 1999·Granted Dec 26, 2000·124 cites·11 claims
- 0990US8076773B2Thermal interface with non-tacky surfaceJEWRAM RADESH·Filed 2007·Granted Dec 13, 2011·19 cites·3 claims
- 1088US6624224B1Method of preparing thermally conductive compounds by liquid metal bridged particle clustersBERGQUIST CO·Filed 2000·Granted Sep 23, 2003·41 cites·6 claims
- 1186US7760507B2Thermally and electrically conductive interconnect structuresBERGQUIST CO·Filed 2007·Granted Jul 20, 2010·15 cites·20 claims
- 1285US12115287B2Methods and materials for reducing venous neointimal hyperplasia of an arteriovenous fistula or graftMAYO FOUND MEDICAL EDUCATION & RES·Filed 2022·Granted Oct 15, 2024·0 cites·4 claims
- 1384US9611414B2Thermal interface material with mixed aspect ratio particle dispersionsHenkel IP & Holding GmbH·Filed 2014·Granted Apr 4, 2017·6 cites·13 claims
- 1484US6797758B2Morphing fillers and thermal interface materialsBERGQUIST CO·Filed 2001·Granted Sep 28, 2004·49 cites·6 claims
- 1583US6399209B1Integrated release films for phase-change interfacesBERGQUIST CO·Filed 2000·Granted Jun 4, 2002·42 cites·11 claims
- 1680USRE39992EMorphing fillers and thermal interface materialsBERGQUIST CO·Filed 2005·Granted Jan 1, 2008·12 cites·11 claims
- 1777US8856594B2Method and system for an end-to-end solution in a test automation frameworkKURAPATI PAVAN KUMAR·Filed 2011·Granted Oct 7, 2014·13 cites·28 claims
- 1875US6984685B2Thermal interface pad utilizing low melting metal with retention matrixBERGQUIST CO·Filed 2002·Granted Jan 10, 2006·26 cites·6 claims
- 1974US6649325B1Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparationBERGQUIST CO·Filed 2001·Granted Nov 18, 2003·23 cites·10 claims
- 2073US9999158B2Thermally conductive EMI suppression compositionsHenkel IP & Holding GmbH·Filed 2013·Granted Jun 12, 2018·4 cites·10 claims
- 2164US2025115799A1Thermal Interface Materials with Soft Filler DispersionsHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 2258US11447677B2Thermal interface material with mixed aspect ratio particle dispersionsHenkel IP & Holding GmbH·Filed 2019·Granted Sep 20, 2022·0 cites·18 claims
- 2357US12466989B2Microemulsions and uses thereofPETROLIAM NASIONAL BERHAD PETRONAS·Filed 2019·Granted Nov 11, 2025·0 cites·7 claims
- 2455US2009208722A1Oriented Members for Thermally Conductive Interface StructuresTIMMERMAN JOHN FRANCIS·Filed 2008·Application pending·0 cites
- 2553US2015140411A1Battery Cell CoatingsBERGQUIST CO·Filed 2013·Application pending·0 cites
- 2652US9862873B2System for removing organic depositsPETROLIAM NASIONAL BERHAD (PETRONAS)·Filed 2016·Granted Jan 9, 2018·0 cites·23 claims
- 2749US2017158936A1Thermal Interface Material with Mixed Aspect Ratio Particle DispersionsHenkel IP & Holding GmbH·Filed 2017·Application pending·0 cites
- 2847US10098897B2Methods and materials for reducing development of stenosis of arteriovenous fistulasMAYO FOUND MEDICAL EDUCATION & RES·Filed 2015·Granted Oct 16, 2018·0 cites·14 claims
- 2947US2014011822A1Methods and materials for reducing venous stenosis formation of an arteriovenous fistula or graftMISRA SANJAY·Filed 2012·Application pending·0 cites
- 3046US2014358637A1Method and system for graphically presenting a survey interface to a userTGG Ventures LLC·Filed 2014·Application pending·0 cites
- 3136US9434871B2Method and system for removing organic depositsHALIM NOR HADHIRAH BT·Filed 2010·Granted Sep 6, 2016·0 cites·29 claims
- 3236US2013042972A1Dual Cure Thermally Conductive AdhesiveTIMMERMAN JOHN·Filed 2011·Application pending·0 cites
- 3335US2004009353A1PCM/aligned fiber composite thermal interfaceFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →