Inventor · disambiguated record
Satoru Mori
Also filed as: MORI SATORU
29 granted patents·6 pending applications·245 citations·filing 1988–2021
95Inventor score
Files withMITSUBISHI MATERIALS CORP20NIPRO CORP4MORI SATORU3MITSUBISHI METAL CORP2ASAHI GLASS CO LTD1
Top patents by PatentIndex Score
35 records- 0187US8384083B2Thin-film transistor having high adhesive strength between barrier film and drain electrode and source electrode filmsMITSUBISHI MATERIALS CORP·Filed 2009·Granted Feb 26, 2013·17 cites·1 claims
- 0282US7250042B2Thrombus suction catheter with improved suction and crossingNIPRO CORP·Filed 2004·Granted Jul 31, 2007·127 cites·10 claims
- 0381US10698398B2Alarm display system and alarm display methodMITSUBISHI HITACHI POWER SYS·Filed 2018·Granted Jun 30, 2020·2 cites·10 claims
- 0468US9748080B2Cu—Ga alloy sputtering target and method for producing sameMITSUBISHI MATERIALS CORP·Filed 2014·Granted Aug 29, 2017·0 cites·20 claims
- 0567USD540468SCatheterNIPRO CORP·Filed 2005·Granted Apr 10, 2007·15 cites·1 claims
- 0667USD540467SCatheterNIPRO CORP·Filed 2005·Granted Apr 10, 2007·15 cites·1 claims
- 0766US11427888B2Sputtering target materialMITSUBISHI MATERIALS CORP·Filed 2019·Granted Aug 30, 2022·1 cites·20 claims
- 0864US10770274B2Copper alloy sputtering target and manufacturing method of copper alloy sputtering targetMITSUBISHI MATERIALS CORP·Filed 2017·Granted Sep 8, 2020·0 cites·12 claims
- 0963USD542413SCatheterNIPRO CORP·Filed 2005·Granted May 8, 2007·13 cites·1 claims
- 1063US6720401B2Coating compositionASAHI GLASS CO LTD·Filed 2001·Granted Apr 13, 2004·7 cites·8 claims
- 1161US9518320B2Copper alloy sputtering targetMITSUBISHI MATERIALS CORP·Filed 2014·Granted Dec 13, 2016·0 cites·1 claims
- 1259US8147427B2Guidewires twist releasing deviceNANTO SHINSUKE·Filed 2010·Granted Apr 3, 2012·4 cites·14 claims
- 1357US10646917B2Copper ingot, copper wire material, and method for producing copper ingotMITSUBISHI MATERIALS CORP·Filed 2014·Granted May 12, 2020·0 cites·5 claims
- 1457US10062552B2Copper alloy sputtering target and manufacturing method of copper alloy sputtering targetMITSUBISHI MATERIALS CORP·Filed 2014·Granted Aug 28, 2018·0 cites·1 claims
- 1554US10351946B2Sputtering target and method for producing sameMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 16, 2019·0 cites·2 claims
- 1654US8502285B2Thin-film transistor and intermediate of thin-film transistorMORI SATORU·Filed 2009·Granted Aug 6, 2013·2 cites·3 claims
- 1753US10017850B2Cu—Ga alloy sputtering target, and method for producing sameMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jul 10, 2018·0 cites·7 claims
- 1852US12241408B2Performance evaluation method, operation control method, performance evaluation device, and programMITSUBISHI HEAVY IND LTD·Filed 2021·Granted Mar 4, 2025·0 cites·14 claims
- 1952US5023144ASilver alloy foil for interconnector for solar cellMITSUBISHI METAL CORP·Filed 1990·Granted Jun 11, 1991·14 cites·2 claims
- 2051US10822691B2Cu—Ga alloy sputtering target and method of manufacturing Cu—Ga alloy sputtering targetMITSUBISHI MATERIALS CORP·Filed 2016·Granted Nov 3, 2020·0 cites·4 claims
- 2151US10443113B2Sputtering target for forming protective film and multilayer wiring filmMITSUBISHI MATERIALS CORP·Filed 2014·Granted Oct 15, 2019·0 cites·2 claims
- 2251US6685654B2Health indicator measuring deviceMISAKI INC·Filed 2001·Granted Feb 3, 2004·10 cites·9 claims
- 2350US10538059B2Sputtering target for forming protective film, and laminated wiring filmMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jan 21, 2020·0 cites·2 claims
- 2448US8796144B2Method of forming thin film interconnect and thin film interconnectMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 5, 2014·0 cites·8 claims
- 2546US5997704ASputtering target for depositing ferroelectric film, method for preparing the same, and method for preparing a DRAM using the sameMITSUBISHI MATERIALS CORP·Filed 1997·Granted Dec 7, 1999·13 cites·23 claims
- 2646US2019040524A1METHOD OF MANUFACTURING Cu-Ga ALLOY SPUTTERING TARGET AND Cu-Ga ALLOY SPUTTERING TARGETMITSUBISHI MATERIALS CORP·Filed 2017·Application pending·0 cites
- 2745US2011192719A1Sputtering target for forming thin film transistor wiring filmMITSUBISHI MATERIALS CORP·Filed 2009·Application pending·0 cites
- 2844US10889889B2High purity copper sputtering target materialMITSUBISHI MATERIALS CORP·Filed 2016·Granted Jan 12, 2021·0 cites·7 claims
- 2944US8658009B2Thin film transistor having a barrier layer as a constituting layer and Cu-alloy sputtering target used for sputter film formation of the barrier layerMAKI KAZUNARI·Filed 2009·Granted Feb 25, 2014·0 cites·1 claims
- 3040US9543128B2Sputtering target for forming protective film and laminated wiring filmMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jan 10, 2017·0 cites·1 claims
- 3139US2006276774A1Thrombus suction catheterMORI SATORU·Filed 2006·Application pending·0 cites
- 3238US2007053786A1Phase change film for semiconductor nonvolatile memory and sputtering target for forming phase change filmMITSUBISHI MATERIALS CORP·Filed 2004·Application pending·0 cites
- 3338US2008125726A1Thrombus Suction Catheter With Excellent CrossabilityMORI SATORU·Filed 2005·Application pending·0 cites
- 3435US2005031484A1Phase change recording film having high electric resistance and sputtering target for forming phase change recording filmMITSUBISHI MATERIALS CORP·Filed 2004·Application pending·0 cites
- 3533US5124311AStructure of ceramic superconductive wiring and process of fabrication thereofMITSUBISHI METAL CORP·Filed 1988·Granted Jun 23, 1992·5 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →