Inventor · disambiguated record
Sanjay Kumar Murugan
Also filed as: MURUGAN SANJAY KUMAR
11 granted patents·3 pending applications·18 citations·filing 2016–2025
83Inventor score
Top patents by PatentIndex Score
14 records- 0189US10347554B2Spatially selective roughening of encapsulant to promote adhesion with functional structureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 9, 2019·7 cites·20 claims
- 0288US9922910B2Functionalized interface structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Mar 20, 2018·7 cites·24 claims
- 0387US11621204B2Molded semiconductor module having a mold step for increasing creepage distanceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 4, 2023·3 cites·22 claims
- 0481US11908771B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 20, 2024·1 cites·23 claims
- 0571US12334414B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2024·Granted Jun 17, 2025·0 cites·24 claims
- 0656US12068213B2Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 20, 2024·0 cites·18 claims
- 0749US2025357232A1Semiconductor package including an encapsulant with a peripheral side wall having a recess and a lead disposed in the recessINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 0847US11211356B2Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Dec 28, 2021·0 cites·17 claims
- 0946US10457001B2Method for forming a matrix composite layer and workpiece with a matrix composite layerINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 29, 2019·0 cites·30 claims
- 1041US2022115245A1Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 1137US11362023B2Package lead design with grooves for improved dambar separationINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 14, 2022·0 cites·17 claims
- 1235US10431526B2Rivetless lead fastening for a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 1, 2019·0 cites·21 claims
- 1334US2016365296A1Electronic Devices with Increased Creepage DistancesINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 1431US10037934B2Semiconductor chip package having contact pins at short side edgesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Jul 31, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →