Inventor · disambiguated record
Sami Nurmi
Also filed as: NURMI SAMI
3 granted patents·9 pending applications·0 citations·filing 2014–2025
41Inventor score
Top patents by PatentIndex Score
12 records- 0159US2024391759A1Mems component with upside-down chipMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0259US2025361143A1Component with improved adhesive bleed-out clearanceMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 0353US2024079350A1Electronic component with reduced stressMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 0452US2025070040A1Electronic component, circuit board and methodMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0552US2025100025A1Electronic component and method for cleaning bonding toolMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0650US2024404937A1Electronic component with improved board level reliabilityMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0746US2023360945A1Electronic component with aligned dieMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 0845US11527497B2Electrical component with component interconnection elementMURATA MANUFACTURING CO·Filed 2021·Granted Dec 13, 2022·0 cites·21 claims
- 0942US9828239B2Method of making a system-in-package device, and a system-in-package deviceMURATA ELECTRONICS OY·Filed 2015·Granted Nov 28, 2017·0 cites·9 claims
- 1040US9663352B2Microelectromechanical device and a method of manufacturingMURATA MANUFACTURING CO·Filed 2014·Granted May 30, 2017·0 cites·8 claims
- 1133US2019112185A1Reducing vibration of a mems installation on a printed circuit boardMURATA MANUFACTURING CO·Filed 2018·Application pending·0 cites
- 1230US2019177159A1Emc protection of a semiconductor componentMURATA MANUFACTURING CO·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →