Inventor · disambiguated record
Saeko Ogawa
Also filed as: OGAWA Saeko
3 granted patents·4 pending applications·1 citations·filing 2019–2022
47Inventor score
Top patents by PatentIndex Score
7 records- 0173US12509615B2Substrate-conveying support tape and electronic apparatus/device production methodSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Dec 30, 2025·1 cites·16 claims
- 0248US2024145256A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0345US12509613B2Resin composition for provisional fixation, support tape for substrate conveyance and method for producing electronic deviceRESONAC CORP·Filed 2019·Granted Dec 30, 2025·0 cites·20 claims
- 0444US12476201B2Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protectionSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·15 claims
- 0544US2024021443A1Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 0641US2024006192A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 0735US2022289920A1Resin composition for temporary fixation, substrate-conveying support tape, and electronic equipment device manufacturing methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →