Inventor · disambiguated record
Sangwon Oh
Also filed as: OH SANGWON
4 granted patents·1 pending application·4 citations·filing 2009–2020
66Inventor score
Files withKOREA ELECTRONICS TELECOMM2ELECTRONICS & TELECOMMUNICATIONS RES INST1EOM YONG SUNG1KOREA RES INST STANDARDS & SCI1
Top patents by PatentIndex Score
5 records- 0166US8420722B2Composition and methods of forming solder bump and flip chip using the sameEOM YONG SUNG·Filed 2009·Granted Apr 16, 2013·3 cites·10 claims
- 0264US9462736B2Composition and methods of forming solder bump and flip chip using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2014·Granted Oct 4, 2016·1 cites·8 claims
- 0355US9155236B2Composition and methods of forming solder bump and flip chip using the sameKOREA ELECTRONICS TELECOMM·Filed 2014·Granted Oct 6, 2015·0 cites·4 claims
- 0452US8802760B2Composition and methods of forming solder bump and flip chip using the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted Aug 12, 2014·0 cites·5 claims
- 0543US2024053208A1Apparatus for measuring temperature using diamond nitrogen-vacancy center sensor and manufacturing method thereforKOREA RES INST STANDARDS & SCI·Filed 2020·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sangwon Oh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →