Inventor · disambiguated record
Sangcheon Park
Also filed as: PARK SANGCHEON
11 granted patents·9 pending applications·17 citations·filing 2020–2025
85Inventor score
Files withSAMSUNG ELECTRONICS CO LTD20
Top patents by PatentIndex Score
20 records- 0195US11289438B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 29, 2022·5 cites·20 claims
- 0294US12266638B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 1, 2025·2 cites·20 claims
- 0394US11658141B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·3 cites·20 claims
- 0493US11749662B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 0591US12327784B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
- 0691US11621247B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 4, 2023·2 cites·20 claims
- 0783US11552033B2Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·1 cites·18 claims
- 0879US2025015026A1Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0978US2024413144A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1077US12094867B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1176US12132019B2Packaged multi-chip semiconductor devices and methods of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1271US2025167179A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1370US2025273554A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1457US2024413125A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1556US2024321923A1Image sensorSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1655US12080691B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 1755US2024395764A1Bonding apparatus for semiconductor device and method of bonding semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1854US2024088006A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1952US2023154910A1Semiconductor chip, semiconductor package, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2049US11824045B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Sangcheon Park files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →