Inventor · disambiguated record
Sangki Park
Also filed as: PARK SANGKI
0 granted patents·3 pending applications·0 citations·filing 2020–2024
Top patents by PatentIndex Score
3 records- 0163US2024400797A1Core-shell typed composite filler with high thermal conductivity, polymer composite material comprising the same, and method for manufacturing the sameKOREA INST SCI & TECH·Filed 2024·Application pending·0 cites
- 0257US2024179777A1Short-range wireless communication method and electronic device thereforSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0351US2024083143A1System and process for forming curved glass laminate article using separation materialCORNING INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →