Inventor · disambiguated record
Sankeerth Rajalingam
Also filed as: RAJALINGAM Sankeerth
2 granted patents·5 pending applications·0 citations·filing 2015–2019
27Inventor score
Files withIBM7
Top patents by PatentIndex Score
7 records- 0162US2018358323A1Pressing solder bumps to match probe profile during wafer level testingIBM·Filed 2017·Application pending·0 cites
- 0253US11131689B2Low-force wafer test probesIBM·Filed 2017·Granted Sep 28, 2021·0 cites·9 claims
- 0352US2019227100A1Processes for fabricating low-force wafer test probes and their structuresIBM·Filed 2019·Application pending·0 cites
- 0449US2018340959A1Processes for fabricating low-force wafer test probes and their structuresIBM·Filed 2018·Application pending·0 cites
- 0548US2018358322A1Pressing solder bumps to match probe profile during wafer level testingIBM·Filed 2017·Application pending·0 cites
- 0647US2018358321A1Pressing solder bumps to match probe profile during wafer level testingIBM·Filed 2017·Application pending·0 cites
- 0738US10288645B2Organic probe substrateIBM·Filed 2015·Granted May 14, 2019·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →