Inventor · disambiguated record
Sabran B. Samsuri
Also filed as: SAMSURI SABRAN B · SAMSURI SABRAN BIN
3 granted patents·104 citations·filing 2001–2004
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0190US6940182B2Flip-chip package with underfill dam for stress controlASE ELECTRONICS M SDN BHD·Filed 2004·Granted Sep 6, 2005·75 cites·16 claims
- 0276US6762509B2Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill materialCELERITY RES PTE LTD·Filed 2001·Granted Jul 13, 2004·24 cites·6 claims
- 0349US6576073B2Adhesive control during stiffener attachment to provide co-planarity in flip chip packagesCELERITY RES PTE LTD·Filed 2001·Granted Jun 10, 2003·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →