Inventor · disambiguated record
Saeed S. Shojaie
Also filed as: SHOJAIE SAEED · SHOJAIE SAEED S
10 granted patents·3 pending applications·22 citations·filing 2003–2021
82Inventor score
Files withINTEL CORP13
Top patents by PatentIndex Score
13 records- 0178US7372133B2Microelectronic package having a stiffening element and method of making sameINTEL CORP·Filed 2005·Granted May 13, 2008·9 cites·15 claims
- 0264US10847450B2Compact wirebonding in stacked-chip system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Nov 24, 2020·1 cites·9 claims
- 0364US9773764B2Solid state device miniaturizationINTEL CORP·Filed 2015·Granted Sep 26, 2017·1 cites·19 claims
- 0461US7141452B2Methods of reducing bleed-out of underfill and adhesive materialsINTEL CORP·Filed 2003·Granted Nov 28, 2006·11 cites·14 claims
- 0560US11700696B2Buried electrical debug access portINTEL CORP·Filed 2021·Granted Jul 11, 2023·0 cites·13 claims
- 0650US10090261B2Microelectronic package debug access ports and methods of fabricating the sameINTEL CORP·Filed 2017·Granted Oct 2, 2018·0 cites·14 claims
- 0749US9646952B2Microelectronic package debug access portsINTEL CORP·Filed 2015·Granted May 9, 2017·0 cites·16 claims
- 0849US2019131278A1Multichip packaging for dice of different sizesINTEL CORP·Filed 2018·Application pending·0 cites
- 0948US11064612B2Buried electrical debug access portINTEL CORP·Filed 2016·Granted Jul 13, 2021·0 cites·17 claims
- 1048US2018138159A1Solid state device miniaturizationINTEL CORP·Filed 2017·Application pending·0 cites
- 1146US9936582B2Integrated circuit assemblies with molding compoundINTEL CORP·Filed 2014·Granted Apr 3, 2018·0 cites·20 claims
- 1245US10204884B2Multichip packaging for dice of different sizesINTEL CORP·Filed 2016·Granted Feb 12, 2019·0 cites·8 claims
- 1326US2018090467A1Package with thermal couplingINTEL CORP·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Saeed S. Shojaie files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →