Inventor · disambiguated record
Sanghyun Son
Also filed as: SON SANGHYUN
3 granted patents·5 pending applications·0 citations·filing 2020–2025
45Inventor score
Top patents by PatentIndex Score
8 records- 0172US2025357286A1Semiconductor Device and Method of Disposing Electrical Components Over Side Surfaces of Interconnect SubstrateSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0264US12400941B2Semiconductor device and method of disposing electrical components over side surfaces of interconnect substrateSTATS CHIPPAC PTE LTD·Filed 2022·Granted Aug 26, 2025·0 cites·32 claims
- 0362US12456689B2Interconnect device and semiconductor assembly incorporating the sameSTATS CHIPPAC PTE LTD·Filed 2023·Granted Oct 28, 2025·0 cites·15 claims
- 0450US12176335B2Semiconductor device and method using tape attachmentSTATS CHIPPAC PTE LTD·Filed 2022·Granted Dec 24, 2024·0 cites·19 claims
- 0549US2024167881A1Device for visualizing temperature and amount of static electricitySEMES CO LTD·Filed 2023·Application pending·0 cites
- 0641US2024096920A1Sensor assembly and method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0740US2024105467A1Semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0833US2021112662A1Wafer type sensor unit and wafer type sensor unit manufacturing methodSEMES CO LTD·Filed 2020·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sanghyun Son files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →