Inventor · disambiguated record
Sangsub Song
Also filed as: SONG SANGSUB
4 granted patents·12 pending applications·2 citations·filing 2020–2024
59Inventor score
Files withSAMSUNG ELECTRONICS CO LTD16
Top patents by PatentIndex Score
16 records- 0182US11569200B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 31, 2023·2 cites·12 claims
- 0267US2024234367A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0366US12237302B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0454US2025259921A1Package substrate and semiconductor package including the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0552US2025193997A1Multilayer wiring substrate and semiconductor package including the multilayer wiring substrateSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0652US2025192035A1Semiconductor chip with dual chip-pad structure and semiconductor package including semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0752US2025183186A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0851US2025239575A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0950US2024224544A1Processor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1049US11500796B2Device for interfacing between memory device and memory controller, package and system including the deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·19 claims
- 1149US2024113074A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1248US2024243096A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1347US2023260889A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1447US2023343746A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1543US12482789B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·17 claims
- 1634US2021103791A1Card type solid state driveSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →