Inventor · disambiguated record
Sang Sub Song
Also filed as: SONG SANG SUB
14 granted patents·12 pending applications·56 citations·filing 2005–2024
89Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18SEOUL NAT UNIV IND FOUNDATION3KWAK DONG-OK2SONG SANG-SUB2SONG IN-SANG1
Top patents by PatentIndex Score
26 records- 0192US11848308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 19, 2023·3 cites·20 claims
- 0291US9847319B2Solid state drive package and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 19, 2017·19 cites·20 claims
- 0385US8838885B2Solid state drive packages and related methods and systemsKWAK DONG-OK·Filed 2012·Granted Sep 16, 2014·11 cites·18 claims
- 0484US8937370B2Memory device and fabricating method thereofSONG IN-SANG·Filed 2012·Granted Jan 20, 2015·8 cites·15 claims
- 0582US8791554B2Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substratesKWAK DONG-OK·Filed 2012·Granted Jul 29, 2014·8 cites·20 claims
- 0679US11330731B2Memory card socket and electronic apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·1 cites·19 claims
- 0771US11251169B2Method of fabricating semiconductor package and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 15, 2022·1 cites·17 claims
- 0871US10074632B2Solid-state driveSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 11, 2018·2 cites·15 claims
- 0966US11791321B2Method of fabricating semiconductor package and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·19 claims
- 1066US10691338B2Data storage device and data processing system including sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 23, 2020·1 cites·18 claims
- 1165US9379062B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 28, 2016·2 cites·20 claims
- 1261US2025286030A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1361US2025174535A1Wiring substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1455US2025300058A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1554US2025201776A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1654US2025226331A1Bridge chip, semiconductor package including bridge chip and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1753US2025149458A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1853US2025118672A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1952US11452206B2Card-type solid state driveSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·19 claims
- 2051US12456708B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 2147US2024194640A1Substrate for semiconductor package and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2241US7375428B2Flip-chip bonding structure using multi chip module-deposited substrateSEOUL NAT UNIV IND FOUNDATION·Filed 2005·Granted May 20, 2008·0 cites·17 claims
- 2337US2007284728A1Flip-chip bonding structure using multi chip module-deposited substrateSEOUL NAT UNIV IND FOUNDATION·Filed 2006·Application pending·0 cites
- 2436US2010308925A1Method of producing micromachined air-cavity resonator, micromachined air-cavity resonator, band-pass filter and oscillator using the methodSEOUL NAT UNIV IND FOUNDATION·Filed 2009·Application pending·0 cites
- 2536US2012061816A1Semiconductor package and method of fabricating the sameSONG SANG-SUB·Filed 2011·Application pending·0 cites
- 2634US2012068306A1Semiconductor package including decoupling semiconductor capacitorSONG SANG-SUB·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →