Inventor · disambiguated record
Sagar Suthram
Also filed as: SUTHRAM SAGAR
7 granted patents·100 pending applications·0 citations·filing 2018–2025
68Inventor score
Top patents by PatentIndex Score
107 records- 0173US12471362B2Integrated circuit structures having ultra-high conductivity global routingINTEL CORP·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 0265US2025358993A1Multi-gate negative differential impedance device for sramINTEL CORP·Filed 2024·Application pending·0 cites
- 0365US2025357327A1Design and process for a precision resistorINTEL CORP·Filed 2025·Application pending·0 cites
- 0464US12498876B2Performing distributed processing using distributed memoryINTEL CORP·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 0564US12471334B2Integrated circuit devices with angled transistors formed based on angled wafersINTEL CORP·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 0662US2025386478A1Multi-layer conductive vias with etch-selective linersINTEL CORP·Filed 2024·Application pending·0 cites
- 0761US2025309109A1Integrated circuit structures with programmable stacked capacitorsINTEL CORP·Filed 2024·Application pending·0 cites
- 0861US2025311443A1Backend compatible diodes for integrated circuit devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0961US2025309211A1Interconnect die between logic dies stacked over a base die with embedded memoryINTEL CORP·Filed 2024·Application pending·0 cites
- 1061US2025311437A1Inter-die connectivity with a backend switchINTEL CORP·Filed 2024·Application pending·0 cites
- 1161US2025336616A1Integrated circuit structures with backend nanoelectromechanical system switchesINTEL CORP·Filed 2024·Application pending·0 cites
- 1260US2025311252A1Integrated circuit structures with capacitors with porous materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 1360US2025309094A1Integrated circuit structures with capacitor banks for power deliveryINTEL CORP·Filed 2024·Application pending·0 cites
- 1459US12506127B2Package architecture of photonic system with vertically stacked dies having planarized edgesINTEL CORP·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 1559US2025201768A1Package architectures having vertically stacked dies with high capacity memory for power deliveryINTEL CORP·Filed 2023·Application pending·0 cites
- 1659US2025293155A1Backend transistor formation techniques including seeded epitaxial growthINTEL CORP·Filed 2024·Application pending·0 cites
- 1759US2025201767A1Package architectures having vertically stacked dies with boundary through-substrate vias for solder interconnectsINTEL CORP·Filed 2023·Application pending·0 cites
- 1859US2025389590A1Transistors with pyroelectric material layer for threshold voltage controlINTEL CORP·Filed 2024·Application pending·0 cites
- 1959US2025311418A1Integrated circuit device with heterogeneous semiconductor orientationINTEL CORP·Filed 2024·Application pending·0 cites
- 2059US2025311395A1Vertical diodes with front and back contactsINTEL CORP·Filed 2024·Application pending·0 cites
- 2159US2025201793A1Package architectures having vertically stacked dies for high capacity memoryINTEL CORP·Filed 2023·Application pending·0 cites
- 2258US2025389591A1Memory devices with pyroelectric material layerINTE CORP·Filed 2024·Application pending·0 cites
- 2358US2025079263A1Package architectures having vertically stacked dies with a cooling microchannelINTEL CORP·Filed 2023·Application pending·0 cites
- 2458US2025107107A1Stacked memory layers with uniform accessINTEL CORP·Filed 2023·Application pending·0 cites
- 2558US2025201766A1Package architectures having vertically stacked dies and voltage convertersINTEL CORP·Filed 2023·Application pending·0 cites
- 2658US2025079399A1Package architectures having vertically stacked dies as a solid state batteryINTEL CORP·Filed 2023·Application pending·0 cites
- 2758US2025210587A1Package architectures having vertically stacked dies and voltage domain stackingINTEL CORP·Filed 2023·Application pending·0 cites
- 2858US2025107108A1Memory layers bonded to logic layers with inclinationINTEL CORP·Filed 2023·Application pending·0 cites
- 2958US2025079398A1Package architectures having vertically stacked dies and voltage regulatorsINTEL CORP·Filed 2023·Application pending·0 cites
- 3058US2025062278A1Package architectures having vertically stacked dies with solder interconnectsINTEL CORP·Filed 2023·Application pending·0 cites
- 3157US2024215222A1Integrated circuit structures having backside power delivery and signal routing for front side dramINTEL CORP·Filed 2022·Application pending·0 cites
- 3257US2025008723A1Three-dimensional floating body memoryINTEL CORP·Filed 2023·Application pending·0 cites
- 3357US2024429162A1Integrated circuit devices with conductive lines extending over scribe linesINTEL CORP·Filed 2023·Application pending·0 cites
- 3456US2024107749A1Arrangements for memory with one access transistor for multiple capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 3556US2025140741A1Package architecture with thermal enhancements for vertically oriented integrated circuit diesINTEL CORP·Filed 2023·Application pending·0 cites
- 3656US2023422496A1Logic circuits using vertical transistors with backside source or drain regionsINTEL CORP·Filed 2023·Application pending·0 cites
- 3755US12506128B2Package architecture of scalable compute wall having compute bricks with vertically stacked diesINTEL CORP·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 3855US2024222326A1Package architecture with memory chips having different process regionsINTEL CORP·Filed 2022·Application pending·0 cites
- 3955US2024224488A1Integrated circuit structures having two-level memoryINTEL CORP·Filed 2022·Application pending·0 cites
- 4055US2024215256A1Integrated circuit structures having backside capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 4155US2024222228A1Devices in a silicon carbide layer coupled with devices in a gallium nitride layerINTEL CORP·Filed 2022·Application pending·0 cites
- 4255US2024222271A1Integrated circuit structures having routing across layers of channel structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 4355US2024222347A1Modular memory blocks for integrated circuit devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 4455US2024222321A1Package architecture with memory chips having different process regionsINTEL CORP·Filed 2022·Application pending·0 cites
- 4555US2024222276A1Integrated circuit structures having lookup table decoders for fpgasINTEL CORP·Filed 2022·Application pending·0 cites
- 4655US2024222520A1Integrated circuit structures having vertical shared gate high-drive thin film transistorsINTEL CORP·Filed 2022·Application pending·0 cites
- 4755US2024222328A1Package architecture with memory chips having different process regionsINTEL CORP·Filed 2022·Application pending·0 cites
- 4855US2024222435A1Coupling a layer of silicon carbide with an adjacent layerINTEL CORP·Filed 2022·Application pending·0 cites
- 4954US2024071955A1Full wafer device with multiple directional indicatorsINTEL CORP·Filed 2022·Application pending·0 cites
- 5054US2024008244A1Scaled gain cell enhanced at low temperaturesINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 107 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →