Inventor · disambiguated record
Sai-Wang Tam
Also filed as: TAM SAI-WANG
20 granted patents·4 pending applications·84 citations·filing 2009–2024
92Inventor score
Top patents by PatentIndex Score
24 records- 0191US10581478B1Radio-frequency front end with power amplifier detuning to reduce output degradationMARVELL INT LTD·Filed 2019·Granted Mar 3, 2020·18 cites·21 claims
- 0291US8971421B2Milli-meter-wave-wireless-interconnect (M2W2-interconnect) method for short-range communications with ultra-high data rate capabilityUNIV CALIFORNIA·Filed 2014·Granted Mar 3, 2015·12 cites·26 claims
- 0390US11374615B1Third order intermodulation distortion cancellationNXP USA INC·Filed 2021·Granted Jun 28, 2022·3 cites·20 claims
- 0484US8270316B1On-chip radio frequency (RF) interconnects for network-on-chip designsCHANG MAU-CHUNG F·Filed 2009·Granted Sep 18, 2012·29 cites·34 claims
- 0579US9385666B2Power amplifier with wide band AM-AM feedback and digital pre-distortionMARVELL WORLD TRADE LTD·Filed 2014·Granted Jul 5, 2016·7 cites·16 claims
- 0674US9768743B1Memory effect reduction using low impedance cascode biasingMARVELL INT LTD·Filed 2015·Granted Sep 19, 2017·3 cites·17 claims
- 0773US10879578B2MM-wave waveguide with an electrically-insulating core having an electrically-conductive transmission line disposed inside the coreMARVELL WORLD TRADE LTD·Filed 2019·Granted Dec 29, 2020·2 cites·12 claims
- 0871US11277097B1Open-loop adaptive bias power amplifierMARVELL ASIA PTE LTD·Filed 2020·Granted Mar 15, 2022·1 cites·16 claims
- 0969US11128375B2Dispersion compensation in mm-wave communication over plastic waveguide using composite right/left-handed metamaterial assemblyMARVELL WORLD TRADE LTD·Filed 2019·Granted Sep 21, 2021·2 cites·20 claims
- 1068US12489209B2Reconfigurable intelligent surface architecture with RFID arrayNXP USA INC·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 1164US9634737B2Periodic near field directors (PNFD) for short-range milli-meter-wave-wireless-interconnect (M2W2-interconnect)CHANG MAU-CHUNG FRANK·Filed 2011·Granted Apr 25, 2017·2 cites·20 claims
- 1264US9178725B2Multi-band interconnect for inter-chip and intra-chip communicationsUNIV CALIFORNIA·Filed 2013·Granted Nov 3, 2015·3 cites·50 claims
- 1362US8817891B2Milli-meter-wave-wireless-interconnect (M2W2-interconnect) method for short-range communications with ultra-high data rate capabilityTAM SAI-WANG·Filed 2010·Granted Aug 26, 2014·2 cites·24 claims
- 1460US11764882B1Pre-conditional calibration for third order intermodulation distortion (IMD3) cancellationNXP USA INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 1560US10777864B2In-line connector assembly for connecting first and second sections of a mm-wave waveguide, where the connector assembly includes a connector body having a periodic array of conductive elementsMARVELL WORLD TRADE LTD·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 1658US10826146B2Networking system comprising a waveguide that connects a transmitter to a receiver, where the waveguide includes a guiding array having a periodic array of conductive elementsMARVELL WORLD TRADE LTD·Filed 2019·Granted Nov 3, 2020·0 cites·19 claims
- 1757US2025350251A1Reconfigurable amplifier system with a switchable multiple-coil transformerNXP USA INC·Filed 2024·Application pending·0 cites
- 1857US2025157872A1Finfet with local heatsinking and method of manufacturing the sameNXP BV·Filed 2023·Application pending·0 cites
- 1956US12425056B2Cancellation circuit using digital to time converterNXP USA INC·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 2054US2025337171A1Scalable intelligent reflect array with rfid control for wireless communicationNXP USA INC·Filed 2024·Application pending·0 cites
- 2152US12289130B2Full-duplex contactless connectorsNXP USA INC·Filed 2022·Granted Apr 29, 2025·0 cites·17 claims
- 2249US11777538B2Differential output circuits with configurable harmonic reduction circuits and methods of operation thereofNXP USA INC·Filed 2022·Granted Oct 3, 2023·0 cites·18 claims
- 2343US11381441B2Dispersion compensation in mm-wave communication over plastic waveguide using OFDMNXP USA INC·Filed 2019·Granted Jul 5, 2022·0 cites·20 claims
- 2443US2016197761A1Multi-band interconnect for inter-chip and intra-chip communicationsUNIV CALIFORNIA·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →