Inventor · disambiguated record
Sao-Hsia Tang
Also filed as: TANG SAO-HSIA
6 granted patents·3 pending applications·50 citations·filing 2004–2012
82Inventor score
Top patents by PatentIndex Score
9 records- 0186US7174630B2Method for fabricating connection terminal of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Feb 13, 2007·15 cites·14 claims
- 0277US7151050B2Method for fabricating electrical connection structure of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Dec 19, 2006·7 cites·9 claims
- 0376US7350298B2Method for fabricating circuit board with conductive structurePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 1, 2008·7 cites·22 claims
- 0473US8164003B2Circuit board surface structure and fabrication method thereofTANG SAO-HSIA·Filed 2008·Granted Apr 24, 2012·7 cites·8 claims
- 0569US7341934B2Method for fabricating conductive bump of circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Mar 11, 2008·5 cites·15 claims
- 0658US7253364B2Circuit board having electrically conductive structure formed between circuit layers thereof and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Aug 7, 2007·9 cites·2 claims
- 0744US2006252247A1Processing apparatus for electroplating conductive bumps on organic circuit boardHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 0841US2006252249A1Solder ball pad surface finish structure of circuit board and fabrication method thereofHSU SHIH-PING·Filed 2006·Application pending·0 cites
- 0941US2012175265A1Circuit board surface structure and fabrication method thereofTANG SAO-HSIA·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →