Inventor · disambiguated record
Satoshi Teshima
Also filed as: TESHIMA SATOSHI
12 granted patents·5 pending applications·35 citations·filing 1987–2022
84Inventor score
Top patents by PatentIndex Score
17 records- 0178US4793939ALubricating oil composition comprising a polyalkylene oxide additiveDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1987·Granted Dec 27, 1988·29 cites·8 claims
- 0272US8486555B2Method for producing porous laminate and porous laminateUSAMI YASUSHI·Filed 2006·Granted Jul 16, 2013·2 cites·22 claims
- 0368US8899581B2Image processing apparatus, rotation control method for motor, and computer-readable recording mediumKONICA MINOLTA INC·Filed 2014·Granted Dec 2, 2014·1 cites·27 claims
- 0464US11364555B2DrillBIC TOOL CO LTD·Filed 2019·Granted Jun 21, 2022·1 cites·3 claims
- 0555US9103001B2Ag—Au—Pd ternary alloy bonding wireCHIBA JUN·Filed 2011·Granted Aug 11, 2015·2 cites·11 claims
- 0653US2024217007A1DrillBIC TOOL CO LTD·Filed 2022·Application pending·0 cites
- 0750US9056493B2Image forming apparatus which performs a cleaning operation to remove a film deposited in a motorKONICA MINOLTA INC·Filed 2013·Granted Jun 16, 2015·0 cites·9 claims
- 0845US9207622B2Power controller and image forming apparatusKONICA MINOLTA INC·Filed 2015·Granted Dec 8, 2015·0 cites·18 claims
- 0944US10081508B2Sheet feeder, document reader, and image forming apparatusKONICA MINOLTA INC·Filed 2014·Granted Sep 25, 2018·0 cites·11 claims
- 1043US2010314156A1Au alloy wire for ball bondingTANAKA ELECTRONICS IND·Filed 2008·Application pending·0 cites
- 1143US2011305940A1Method for producing porous laminate and porous laminateUSAMI YASUSHI·Filed 2011·Application pending·0 cites
- 1241US9966767B2Charge control device and image forming apparatus including charge control deviceKONICA MINOLTA INC·Filed 2015·Granted May 8, 2018·0 cites·18 claims
- 1341US8147750B2Gold alloy wire for ball bondingTAKADA MITSUO·Filed 2008·Granted Apr 3, 2012·0 cites·8 claims
- 1441US2023054778A1Hollow drill for medical useBIC TOOL CO LTD·Filed 2020·Application pending·0 cites
- 1537US2008050267A1Au Alloy Bonding WireMURAI HIROSHI·Filed 2005·Application pending·0 cites
- 1629US12285810B2Drill for carbon-fiber composite materialBIC TOOL CO LTD·Filed 2020·Granted Apr 29, 2025·0 cites·9 claims
- 1727US8440137B2Au bonding wire for semiconductor deviceTESHIMA SATOSHI·Filed 2005·Granted May 14, 2013·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →