Inventor · disambiguated record
Sathya Narasimman Tiagaraj
Also filed as: TIAGARAJ SATHYA NARASIMMAN
4 granted patents·8 pending applications·2 citations·filing 2019–2025
59Inventor score
Files withINTEL CORP12
Top patents by PatentIndex Score
12 records- 0189US12406962B2Power delivery through capacitor-dies in a multi-layered microelectronic assemblyINTEL CORP·Filed 2021·Granted Sep 2, 2025·2 cites·20 claims
- 0278US2025253233A1Skip level vias in metallization layers for integrated circuit devicesINTEL CORP·Filed 2025·Application pending·0 cites
- 0375US12315794B2Skip level vias in metallization layers for integrated circuit devicesINTEL CORP·Filed 2022·Granted May 27, 2025·0 cites·12 claims
- 0462US12288746B2Skip level vias in metallization layers for integrated circuit devicesINTEL CORP·Filed 2019·Granted Apr 29, 2025·0 cites·8 claims
- 0557US2024030172A1Three dimensional universal chiplet interconnect as on-package interconnectINTEL CORP·Filed 2023·Application pending·0 cites
- 0655US12164319B2Dual loop voltage regulatorINTEL CORP·Filed 2020·Granted Dec 10, 2024·0 cites·20 claims
- 0751US2023230923A1Microelectronic die including swappable phy circuitry and semiconductor package including sameINTEL CORP·Filed 2022·Application pending·0 cites
- 0849US2022399324A1Active device layer at interconnect interfacesINTEL CORP·Filed 2021·Application pending·0 cites
- 0949US2023095914A1Test and debug support with hbi chiplet architectureINTEL CORP·Filed 2021·Application pending·0 cites
- 1048US2023100375A1Repair and performance chipletINTEL CORP·Filed 2021·Application pending·0 cites
- 1148US2023100228A1Physical and electrical protocol translation chipletsINTEL CORP·Filed 2021·Application pending·0 cites
- 1246US2022399277A1Selective routing through intra-connect bridge diesINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →