Inventor · disambiguated record
Saori Ueda
Also filed as: UEDA SAORI
12 granted patents·10 pending applications·13 citations·filing 2011–2025
84Inventor score
Files withSEKISUI CHEMICAL CO LTD143M INNOVATIVE PROPERTIES CO3PANASONIC IP MAN CO LTD3SUWA TOSHIHIRO1UEDA SAORI1
Top patents by PatentIndex Score
22 records- 0190US11644717B2Dimming laminate and resin spacer for dimming laminateSEKISUI CHEMICAL CO LTD·Filed 2019·Granted May 9, 2023·2 cites·10 claims
- 0287US8911873B2Pressure sensitive adhesive sheet for opticsSUWA TOSHIHIRO·Filed 2011·Granted Dec 16, 2014·8 cites·7 claims
- 0382US10632707B2Multilayer structural adhesive film3M INNOVATIVE PROPERTIES CO·Filed 2016·Granted Apr 28, 2020·2 cites·19 claims
- 0480US2024361639A1Dimming laminate and resin spacer for dimming laminateSEKISUI CHEMICAL CO LTD·Filed 2024·Application pending·0 cites
- 0579US12072583B2Dimming laminate and resin spacer for dimming laminateSEKISUI CHEMICAL CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·9 claims
- 0677US11027374B2Particles, connecting material and connection structureSEKISUI CHEMICAL CO LTD·Filed 2016·Granted Jun 8, 2021·1 cites·6 claims
- 0769US2025232924A1Electrolytic capacitor and production method thereforPANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 0868US10679925B2Adhesive for semiconductor mounting, and semiconductor sensorSEKISUI CHEMICAL CO LTD·Filed 2017·Granted Jun 9, 2020·0 cites·10 claims
- 0965US2025308809A1Electrolytic capacitorPANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 1058US2023140786A1Gap material, adhesive, and display deviceSEKISUI CHEMICAL CO LTD·Filed 2020·Application pending·0 cites
- 1158US2023323163A1Optical bonding particles, adhesive, and display deviceSEKISUI CHEMICAL CO LTD·Filed 2020·Application pending·0 cites
- 1256US2015166841A1Transparent adhesive sheet3M INNOVATIVE PROPERTIES CO·Filed 2013·Application pending·0 cites
- 1355US2025014838A1Solid electrolytic capacitorPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 1454US11020825B2Connecting material and connection structureSEKISUI CHEMICAL CO LTD·Filed 2016·Granted Jun 1, 2021·0 cites·6 claims
- 1553US10790217B2Adhesive for semiconductor sensor chip mounting, and semiconductor sensorSEKISUI CHEMICAL CO LTD·Filed 2017·Granted Sep 29, 2020·0 cites·6 claims
- 1652US2020199454A1Composite particles, composite-particle powder, and light-modulating materialSEKISUI CHEMICAL CO LTD·Filed 2018·Application pending·0 cites
- 1750US11024439B2Particles, connecting material and connection structureSEKISUI CHEMICAL CO LTD·Filed 2016·Granted Jun 1, 2021·0 cites·7 claims
- 1850US11017916B2Particles, connecting material and connection structureSEKISUI CHEMICAL CO LTD·Filed 2016·Granted May 25, 2021·0 cites·6 claims
- 1946US10961420B2Composition for bonding, optical adhesive, and adhesive for pressure sensorSEKISUI CHEMICAL CO LTD·Filed 2017·Granted Mar 30, 2021·0 cites·7 claims
- 2046US10365418B2Retroreflective sheet, license plate, and manufacturing method thereof3M INNOVATIVE PROPERTIES CO·Filed 2015·Granted Jul 30, 2019·0 cites·10 claims
- 2143US2020012138A1Light control laminate and resin spacer for light control laminatesSEKISUI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2239US2012120440A1Scanner management apparatus, scanning system, and scanner management methodUEDA SAORI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →