Inventor · disambiguated record
Sam Vaziri
Also filed as: VAZIRI SAM
4 granted patents·20 pending applications·3 citations·filing 2020–2025
62Inventor score
Top patents by PatentIndex Score
24 records- 0193US11842946B2Semiconductor package having an encapsulant comprising conductive fillers and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 0280US12261095B2Semiconductor package having an encapulant comprising conductive fillers and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0376US2025357144A1Semiconductor structure with thermal dissipation layer and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0476US2025357255A1Integrated circuit (ic) structures with thermal componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0575US2025349651A1Integrated circuit (ic) structures with thermal vias and heat spreader layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0675US2025336762A1Integrated circuit device with thermoelectric coolingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0774US2025336764A1Passive thermal control layer for integrated deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0873US2025210452A1Semiconductor package having an encapulant comprising conductive fillers and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0972US11908690B2Multi-layered semiconductive device and methodology with polymer and transition metal dichalcogenide materialUNIV LELAND STANFORD JUNIOR·Filed 2020·Granted Feb 20, 2024·1 cites·23 claims
- 1071US2025140642A1Integrated circuit device with thermoelectric coolingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1170US2025140640A1Semiconductor device with heat dissipation layer and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1269US2025149345A1Semiconductor structure with thermal dissipation layer and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1369US2025167074A1Passive thermal control layer for integrated deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1469US2025140632A1Integrated circuit (ic) structures with thermal vias and heat spreader layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1569US2025140641A1Integrated circuit (ic) structures with thermal componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1661US12512445B2Package structure, semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·20 claims
- 1760US2025189383A1Semiconductor structure having thermal sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1856US2025210446A1Integrated circuit and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1956US2025201633A1Thermal characterization method and manufacturing of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2056US2025201646A1Semiconductor structure having thermal sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2156US2025226277A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2256US2025192103A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2356US2025218899A1Integrated circuit and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2451US2023240081A1Memory device and method of forming the same and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →