Inventor · disambiguated record
Sang Hyun Yi
Also filed as: YI SANG HYUN
15 granted patents·7 pending applications·34 citations·filing 2002–2021
89Inventor score
Files withSAMSUNG ELECTRO MECH10SAMSUNG ELECTRONICS CO LTD6MOSAID TECHNOLOGIES INC2YI SANG HYUN2CONVERSANT INTELLECTUAL PROPERTY MAN INC1
Top patents by PatentIndex Score
22 records- 0191US8946897B2Semiconductor device having metal lines with slitsMOSAID TECHNOLOGIES INC·Filed 2013·Granted Feb 3, 2015·10 cites·27 claims
- 0290US10910170B2Electronic device and electronic device manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 2, 2021·5 cites·12 claims
- 0373US9232680B2Frame structure for preventing deformation, and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 5, 2016·4 cites·20 claims
- 0470US7863746B2Semiconductor device having metal lines with slitsMOSAID TECHNOLOGIES INC·Filed 2007·Granted Jan 4, 2011·3 cites·4 claims
- 0569US11430617B2Electronic device and electronic device manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 30, 2022·0 cites·20 claims
- 0666US10340882B2Bulk acoustic wave filterSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 2, 2019·1 cites·15 claims
- 0765US7233070B2Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 19, 2007·10 cites·16 claims
- 0860US11705884B2Bulk acoustic resonatorSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 18, 2023·0 cites·21 claims
- 0959US7847403B2Semiconductor device having no cracks in one or more layers underlying a metal line layerSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 7, 2010·1 cites·24 claims
- 1054US8673622B2Cell chip and method for manufacturing the sameLEE DONG WOO·Filed 2012·Granted Mar 18, 2014·0 cites·11 claims
- 1152US10992281B2Bulk acoustic wave resonator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Apr 27, 2021·0 cites·22 claims
- 1252US10715099B2Bulk acoustic wave resonator and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 14, 2020·0 cites·9 claims
- 1352US2014141504A1Gel-forming deviceSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1451US10790798B2Acoustic resonator and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Sep 29, 2020·0 cites·16 claims
- 1550US2015187706A1Semiconductor Device Having Metal Lines with SlitsCONVERSANT INTELLECTUAL PROPERTY MAN INC·Filed 2015·Application pending·0 cites
- 1647US2022085791A1Bulk-acoustic wave resonatorSAMSUNG ELECTRO MECH·Filed 2021·Application pending·0 cites
- 1746US2022149806A1Bulk acoustic wave resonatorSAMSUNG ELECTRO MECH·Filed 2021·Application pending·0 cites
- 1845US2014360288A1Droplet forming device and method of forming droplet using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1944US8421229B2Semiconductor device having metal lines with slitsYI SANG-HYUN·Filed 2010·Granted Apr 16, 2013·0 cites·19 claims
- 2043US2013133778A1Incubating container and sample injection method thereforYI SANG HYUN·Filed 2012·Application pending·0 cites
- 2139US6777806B2Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 17, 2004·0 cites·10 claims
- 2237US2016077043A1Biochip and device for measuring biochipSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →