Inventor · disambiguated record
Satoshi Yoneda
Also filed as: YONEDA SATOSHI
22 granted patents·13 pending applications·255 citations·filing 1990–2025
94Inventor score
Files withMITSUBISHI ELECTRIC CORP9HD MICROSYSTEMS LTD4TOYOTA MOTOR CO LTD4YONEDA SATOSHI4ES FIBERVISIONS CO LTD2
Top patents by PatentIndex Score
35 records- 0194US6404248B1Delay locked loop circuit for synchronizing internal supply clock with reference clockNEC CORP·Filed 2001·Granted Jun 11, 2002·75 cites·9 claims
- 0289US7151568B2Displacement sensorOMRON TATEISI ELECTRONICS CO·Filed 2001·Granted Dec 19, 2006·57 cites·26 claims
- 0387US11381213B2Noise filter and electrical and electronic equipmentMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jul 5, 2022·2 cites·6 claims
- 0478US8940100B2Method for cleaning hot dip galvanized steel sheet and cleaning apparatus thereforYONEDA SATOSHI·Filed 2007·Granted Jan 27, 2015·4 cites·8 claims
- 0578US6157690ADigital PLL circuitNEC CORP·Filed 1998·Granted Dec 5, 2000·47 cites·2 claims
- 0677US7620094B2Spread spectrum clock generatorNEC ELECTRONICS CORP·Filed 2005·Granted Nov 17, 2009·9 cites·20 claims
- 0776US8828693B2Method for producing isopropanol and recombinant yeast capable of producing isopropanolMURAMATSU MASAYOSHI·Filed 2010·Granted Sep 9, 2014·2 cites·3 claims
- 0875US6569334B1Method of high-concentration culture of nitrifying bacteria or denitrifying bacteria contained in activated sludge, culture promoter to be used in high-concentration culture method of nitrifying bacteria, and method of weight loss treatment of activated sludgeBICOM CORP·Filed 2000·Granted May 27, 2003·23 cites·22 claims
- 0975US2025364727A1Electromagnetic wave absorberMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1071US9005953B2Recombinant microorganism having butanol production capacity and butanol production methodMURAMATSU MASAYOSHI·Filed 2010·Granted Apr 14, 2015·1 cites·2 claims
- 1166US8160193B2Spread spectrum clock generatorYONEDA SATOSHI·Filed 2008·Granted Apr 17, 2012·5 cites·8 claims
- 1261US8435413B2Method for controlling a waste water concentration of cleaning solution containing phosphorusYONEDA SATOSHI·Filed 2008·Granted May 7, 2013·1 cites·3 claims
- 1358US2023332337A1Heat-bondable composite fiber, method for producing same and nonwoven fabric using heat-bondable composite fiberES FIBERVISIONS CO LTD·Filed 2021·Application pending·0 cites
- 1457US10366826B2Dual-mode choke coil and high-frequency filter using same, and on-board motor integrated electric power steering and on-board charging deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 30, 2019·1 cites·19 claims
- 1557US5058181AHardware and software image processing systemOMRON TATEISI ELECTRONICS CO·Filed 1990·Granted Oct 15, 1991·28 cites·14 claims
- 1657US2025119119A1Filter circuitMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1756US2013284219A1Apparatus for cleaning a hot dip galvanized steel sheetJFE STEEL CORP·Filed 2013·Application pending·0 cites
- 1855US11437969B2Coupling loop circuit, noise filter circuit, and circuit generation methodMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Sep 6, 2022·0 cites·8 claims
- 1953US9217183B2Method for producing isopropanol and recombinant yeast capable of producing isopropanolTOYOTA MOTOR CO LTD·Filed 2014·Granted Dec 22, 2015·0 cites·3 claims
- 2053US8541213B2Recombinant yeast and branched alcohol production method using recombinant yeastYONEDA SATOSHI·Filed 2012·Granted Sep 24, 2013·0 cites·7 claims
- 2151US2025123009A1Air conditioner outdoor unitMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2251US2025224124A1Outdoor unit of air conditionerMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2351US2023313420A1Heat-bondable composite fiber, manufacturing method for same, and non-woven fabric using heat-bondable composite fiberES FIBERVISIONS CO LTD·Filed 2021·Application pending·0 cites
- 2448US12228491B2Measurement apparatus and quality control methodSYSMEX CORP·Filed 2019·Granted Feb 18, 2025·0 cites·14 claims
- 2548US2025233103A1Method of manufacturing semiconductor device, hybrid bonding insulation film forming material and semiconductor deviceHD MICROSYSTEMS LTD·Filed 2023·Application pending·0 cites
- 2648US2025201760A1Hybrid bonding insulation membrane forming material, method of producing semiconductor device and semiconductor deviceHD MICROSYSTEMS LTD·Filed 2023·Application pending·0 cites
- 2747US2024018306A1Resin composition, method for producing semiconductor device, cured product, semiconductor device, and method for synthesizing polyimide precursorRESONAC CORP·Filed 2021·Application pending·0 cites
- 2846US12463191B2Method for manufacturing electronic component device and electronic component deviceSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Nov 4, 2025·0 cites·10 claims
- 2946US11121692B2Noise filter circuitMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 14, 2021·0 cites·9 claims
- 3045US11807721B2Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic componentHD MICROSYSTEMS LTD·Filed 2018·Granted Nov 7, 2023·0 cites·8 claims
- 3145US2010311136A1Recombinant yeast and branched alcohol production method using recombinant yeastTOYOTA MOTOR CO LTD·Filed 2010·Application pending·0 cites
- 3237US10749494B2Noise filter circuitMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 18, 2020·0 cites·10 claims
- 3337US2010324282A1Method for separating heteropolyacidTOYOTA MOTOR CO LTD·Filed 2010·Application pending·0 cites
- 3436US12386256B2Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic componentHD MICROSYSTEMS LTD·Filed 2019·Granted Aug 12, 2025·0 cites·9 claims
- 3536US2016028090A1Cathode for fuel cellTOYOTA MOTOR CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →