Inventor · disambiguated record
Sangmin Yong
Also filed as: YONG SANGMIN
4 granted patents·0 citations·filing 2021–2023
54Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0165US12021032B2Semiconductor package having an interposer and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0257US11694961B2Semiconductor package having an interposer and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·11 claims
- 0349US11935867B2Semiconductor package with memory stack structure connected to logic dies via an interposerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 0448US12272628B2Semiconductor package having interposer substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →