Inventor · disambiguated record
Satoru Zama
Also filed as: ZAMA SATORU
8 granted patents·5 pending applications·41 citations·filing 1998–2012
84Inventor score
Top patents by PatentIndex Score
13 records- 0183US8637164B2Silver-coated composite material for a movable contact part, method of producing the same, and movable contact partKOBAYASHI YOSHIAKI·Filed 2012·Granted Jan 28, 2014·3 cites·11 claims
- 0280US8337997B2Composite material for electrical/electronic part and electrical/electronic part using the sameSUGAHARA CHIKAHITO·Filed 2010·Granted Dec 25, 2012·3 cites·5 claims
- 0376US8158269B2Composite material for electrical/electronic part and electrical/electronic part using the sameSUGAHARA CHIKAHITO·Filed 2010·Granted Apr 17, 2012·2 cites·6 claims
- 0473US7976956B2Laminated circuit boardFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Jul 12, 2011·6 cites·3 claims
- 0560US8476534B2Multilayer printed board and method for manufacturing the sameZAMA SATORU·Filed 2008·Granted Jul 2, 2013·3 cites·8 claims
- 0652US6123552AIC socketFURUKAWA ELECTRIC CO LTD·Filed 1998·Granted Sep 26, 2000·20 cites·8 claims
- 0751US6963676B2Optical module and method of assembling the optical moduleFURUKAWA ELECTRIC CO LTD·Filed 2004·Granted Nov 8, 2005·3 cites·28 claims
- 0850US8147904B2Metal clad laminate and method for manufacturing metal clad laminateZAMA SATORU·Filed 2009·Granted Apr 3, 2012·1 cites·6 claims
- 0948US2010092680A1Process for producing metal clad laminateOHGA KENICHI·Filed 2007·Application pending·0 cites
- 1048US2009291318A1Composite material for electric and electronic components, electric and electronic components, and method for manufacturing composite material for electric and electronic componentsSUGAHARA CHIKAHITO·Filed 2007·Application pending·0 cites
- 1147US2013099270A1Lead frame for optical semiconductor device, method of producing the same, and optical semiconductor deviceFURUKAWA ELECTRIC CO LTD·Filed 2012·Application pending·0 cites
- 1245US2007228443A1Conductive base material with thin film resistance layer, method of production of conductive base material with thin film resistance layer, and circuit board with thin film resistance layerFURUKAWA ELECTRIC CO LTD·Filed 2007·Application pending·0 cites
- 1343US2007048507A1Laminated circuit boardFURUKAWA ELECTRIC CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →