Inventor · disambiguated record
Sam Ziqun Zhao
Also filed as: ZHAO SAM · ZHAO SAM Z · ZHAO SAM ZIQUN
122 granted patents·40 pending applications·2,701 citations·filing 2001–2025
99Inventor score
Files withBROADCOM CORP80ZHAO SAM ZIQUN21AVAGO TECH INT SALES PTE LID20AVAGO TECHNOLOGIES GENERAL IP7ROFOUGARAN AHMADREZA REZA6
Top patents by PatentIndex Score
162 records- 0199US8508045B2Package 3D interconnection and method of making sameKHAN REZAUR RAHMAN·Filed 2011·Granted Aug 13, 2013·88 cites·22 claims
- 0298US8823144B2Semiconductor package with interface substrate having interposerBROADCOM CORP·Filed 2013·Granted Sep 2, 2014·33 cites·14 claims
- 0398US7808087B2Leadframe IC packages having top and bottom integrated heat spreadersBROADCOM CORP·Filed 2006·Granted Oct 5, 2010·97 cites·30 claims
- 0498US7781266B2Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packagesBROADCOM CORP·Filed 2009·Granted Aug 24, 2010·83 cites·15 claims
- 0598US7714453B2Interconnect structure and formation for package stacking of molded plastic area array packageBROADCOM CORP·Filed 2007·Granted May 11, 2010·89 cites·22 claims
- 0698US7582951B2Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packagesBROADCOM CORP·Filed 2005·Granted Sep 1, 2009·109 cites·44 claims
- 0798US7202559B2Method of assembling a ball grid array package with patterned stiffener layerBROADCOM CORP·Filed 2005·Granted Apr 10, 2007·68 cites·16 claims
- 0898US6989593B2Die-up ball grid array package with patterned stiffener openingBROADCOM CORP·Filed 2002·Granted Jan 24, 2006·93 cites·25 claims
- 0998US6906414B2Ball grid array package with patterned stiffener layerBROADCOM CORP·Filed 2002·Granted Jun 14, 2005·222 cites·37 claims
- 1098US6861750B2Ball grid array package with multiple interposersBROADCOM CORP·Filed 2002·Granted Mar 1, 2005·163 cites·33 claims
- 1197US9472485B2Hybrid thermal interface material for IC packages with integrated heat spreaderBROADCOM CORP·Filed 2015·Granted Oct 18, 2016·20 cites·20 claims
- 1297US9431371B2Semiconductor package with a bridge interposerBROADCOM CORP·Filed 2015·Granted Aug 30, 2016·20 cites·21 claims
- 1397US8558395B2Organic interface substrate having interposer with through-semiconductor viasKHAN REZAUR RAHMAN·Filed 2012·Granted Oct 15, 2013·38 cites·13 claims
- 1497US7462933B2Ball grid array package enhanced with a thermal and electrical connectorBROADCOM CORP·Filed 2006·Granted Dec 9, 2008·35 cites·11 claims
- 1597US7161239B2Ball grid array package enhanced with a thermal and electrical connectorBROADCOM CORP·Filed 2002·Granted Jan 9, 2007·105 cites·8 claims
- 1696US8718550B2Interposer package structure for wireless communication element, thermal enhancement, and EMI shieldingZHAO SAM ZIQUN·Filed 2011·Granted May 6, 2014·22 cites·26 claims
- 1796US8021927B2Die down ball grid array packages and method for making sameBROADCOM CORP·Filed 2010·Granted Sep 20, 2011·25 cites·27 claims
- 1896US6882042B2Thermally and electrically enhanced ball grid array packagingBROADCOM CORP·Filed 2001·Granted Apr 19, 2005·86 cites·23 claims
- 1995US9059179B2Semiconductor package with a bridge interposerKARIKALAN SAMPATH K V·Filed 2011·Granted Jun 16, 2015·27 cites·20 claims
- 2095US9013035B2Thermal improvement for hotspots on dies in integrated circuit packagesZHAO SAM ZIQUN·Filed 2006·Granted Apr 21, 2015·24 cites·20 claims
- 2195US8928128B2Semiconductor package with integrated electromagnetic shieldingKARIKALAN SAMPATH K V·Filed 2012·Granted Jan 6, 2015·37 cites·20 claims
- 2295US8587132B2Semiconductor package including an organic substrate and interposer having through-semiconductor viasBROADCOM CORP·Filed 2012·Granted Nov 19, 2013·15 cites·20 claims
- 2395US7227256B2Die-up ball grid array package with printed circuit board attachable heat spreaderBROADCOM CORP·Filed 2002·Granted Jun 5, 2007·60 cites·27 claims
- 2495US7005737B2Die-up ball grid array package with enhanced stiffenerBROADCOM CORP·Filed 2002·Granted Feb 28, 2006·58 cites·32 claims
- 2594US7719110B2Flip chip package including a non-planar heat spreader and method of making the sameBROADCOM CORP·Filed 2007·Granted May 18, 2010·27 cites·15 claims
- 2694US7271479B2Flip chip package including a non-planar heat spreader and method of making the sameBROADCOM CORP·Filed 2004·Granted Sep 18, 2007·72 cites·39 claims
- 2794US6853070B2Die-down ball grid array package with die-attached heat spreader and method for making the sameBROADCOM CORP·Filed 2001·Granted Feb 8, 2005·82 cites·50 claims
- 2893US10008439B2Thin recon interposer package without TSV for fine input/output pitch fan-outAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Jun 26, 2018·10 cites·20 claims
- 2993US8310067B2Ball grid array package enhanced with a thermal and electrical connectorZHAO SAM ZIQUN·Filed 2011·Granted Nov 13, 2012·12 cites·19 claims
- 3093US8213180B2Electromagnetic interference shield with integrated heat sinkZHAO SAM ZIQUN·Filed 2010·Granted Jul 3, 2012·20 cites·19 claims
- 3193US7102225B2Die-up ball grid array package with printed circuit board attachable heat spreaderBROADCOM CORP·Filed 2002·Granted Sep 5, 2006·49 cites·25 claims
- 3292US7893546B2Ball grid array package enhanced with a thermal and electrical connectorBROADCOM CORP·Filed 2008·Granted Feb 22, 2011·16 cites·10 claims
- 3392US6825108B2Ball grid array package fabrication with IC die support structuresBROADCOM CORP·Filed 2002·Granted Nov 30, 2004·58 cites·18 claims
- 3491US11906802B2Photonics integration in semiconductor packagesAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Feb 20, 2024·2 cites·20 claims
- 3591US8686558B2Thermally and electrically enhanced ball grid array packageZHAO SAM ZIQUN·Filed 2011·Granted Apr 1, 2014·9 cites·20 claims
- 3691US8581381B2Integrated circuit (IC) package stacking and IC packages formed by sameZHAO SAM ZIQUN·Filed 2006·Granted Nov 12, 2013·22 cites·23 claims
- 3791US8417861B2Wireless bus for intra-chip and inter-chip communication, including data center/server embodimentsROFOUGARAN AHMADREZA REZA·Filed 2010·Granted Apr 9, 2013·6 cites·20 claims
- 3891US7579217B2Methods of making a die-up ball grid array package with printed circuit board attachable heat spreaderBROADCOM CORP·Filed 2006·Granted Aug 25, 2009·11 cites·18 claims
- 3991US7482686B2Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the sameBRAODCOM CORP·Filed 2004·Granted Jan 27, 2009·62 cites·19 claims
- 4091US7432586B2Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packagesBROADCOM CORP·Filed 2004·Granted Oct 7, 2008·66 cites·34 claims
- 4190US7245500B2Ball grid array package with stepped stiffener layerBROADCOM CORP·Filed 2002·Granted Jul 17, 2007·58 cites·71 claims
- 4290US7241645B2Method for assembling a ball grid array package with multiple interposersBROADCOM CORP·Filed 2004·Granted Jul 10, 2007·50 cites·20 claims
- 4390US6876553B2Enhanced die-up ball grid array package with two substratesBROADCOM CORP·Filed 2002·Granted Apr 5, 2005·52 cites·29 claims
- 4489US9618560B2Apparatus and method to monitor thermal runaway in a semiconductor deviceAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Apr 11, 2017·4 cites·22 claims
- 4589US9041192B2Hybrid thermal interface material for IC packages with integrated heat spreaderSAEIDI SEYED MAHDI·Filed 2012·Granted May 26, 2015·25 cites·20 claims
- 4689US7786591B2Die down ball grid array packageBROADCOM CORP·Filed 2004·Granted Aug 31, 2010·46 cites·20 claims
- 4788US9406636B2Interposer package-on-package structureBROADCOM CORP·Filed 2015·Granted Aug 2, 2016·5 cites·20 claims
- 4888US7791189B2Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the sameBROADCOM CORP·Filed 2009·Granted Sep 7, 2010·13 cites·7 claims
- 4987US9406793B2Semiconductor device with a vertical channel formed through a plurality of semiconductor layersBROADCOM CORP·Filed 2014·Granted Aug 2, 2016·7 cites·20 claims
- 5087US8872321B2Semiconductor packages with integrated heat spreadersZHAO SAM ZIQUN·Filed 2012·Granted Oct 28, 2014·9 cites·20 claims
Showing the top 50 of 162 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →