Inventor · disambiguated record
Scott D. Brandenburg
Also filed as: BRANDENBURG SCOTT · BRANDENBURG SCOTT D · BRANDENBURG SCOTT DAVID
72 granted patents·20 pending applications·1,452 citations·filing 1994–2025
99Inventor score
Files withDELPHI TECH INC48APTIV TECH LTD19BRANDENBURG SCOTT D10Aptiv Technologies AG6DELCO ELECTRONICS CORP6
Top patents by PatentIndex Score
92 records- 0198US7307841B2Electronic package and method of cooling electronicsDELPHI TECH INC·Filed 2005·Granted Dec 11, 2007·89 cites·21 claims
- 0297US6307749B1Overmolded electronic module with underfilled surface-mount componentsDELPHI TECH INC·Filed 2000·Granted Oct 23, 2001·258 cites·20 claims
- 0396US11616306B2Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit boardAPTIV TECH LTD·Filed 2021·Granted Mar 28, 2023·8 cites·20 claims
- 0496US11362436B2Plastic air-waveguide antenna with conductive particlesAPTIV TECH LTD·Filed 2020·Granted Jun 14, 2022·5 cites·20 claims
- 0596US7739791B2Method of producing an overmolded electronic module with a flexible circuit pigtailDELPHI TECH INC·Filed 2007·Granted Jun 22, 2010·55 cites·1 claims
- 0695US7485957B2Fluid cooled encapsulated microelectronic packageDELPHI TECH INC·Filed 2007·Granted Feb 3, 2009·28 cites·1 claims
- 0794US6807731B2Method for forming an electronic assemblyDELPHI TECH INC·Filed 2002·Granted Oct 26, 2004·65 cites·14 claims
- 0893US7616448B2Wrap-around overmold for electronic assemblyDELPHI TECH INC·Filed 2007·Granted Nov 10, 2009·43 cites·7 claims
- 0992US8699225B2Liquid cooled electronics assembly suitable to use electrically conductive coolantBRANDENBURG SCOTT D·Filed 2012·Granted Apr 15, 2014·15 cites·19 claims
- 1092US6779260B1Overmolded electronic package including circuit-carrying substrateDELPHI TECH INC·Filed 2003·Granted Aug 24, 2004·71 cites·32 claims
- 1192US6285551B1Overmolded electronic assemblyDELPHI TECH INC·Filed 2000·Granted Sep 4, 2001·56 cites·10 claims
- 1290US11962087B2Radar antenna system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit boardAptiv Technologies AG·Filed 2023·Granted Apr 16, 2024·1 cites·17 claims
- 1390US7486515B2Fluid circulator for fluid cooled electronic deviceDELPHI TECH INC·Filed 2007·Granted Feb 3, 2009·20 cites·16 claims
- 1489US7473585B2Technique for manufacturing an overmolded electronic assemblyDELPHI TECH INC·Filed 2005·Granted Jan 6, 2009·19 cites·15 claims
- 1589US7440282B2Heat sink electronic package having compliant pedestalDELPHI TECH INC·Filed 2006·Granted Oct 21, 2008·19 cites·15 claims
- 1688US10679770B1Interface layer with mesh and sinter pasteAPTIV TECH LTD·Filed 2019·Granted Jun 9, 2020·2 cites·22 claims
- 1788US7537464B2Electrical pin interconnection for electronic packageDELPHI TECH INC·Filed 2006·Granted May 26, 2009·28 cites·21 claims
- 1888US6180045B1Method of forming an overmolded electronic assemblyDELCO ELECTRONICS CORP·Filed 1998·Granted Jan 30, 2001·66 cites·9 claims
- 1987US10849217B2Electrical-circuit assembly with heat-sinkAPTIV TECH LTD·Filed 2018·Granted Nov 24, 2020·6 cites·17 claims
- 2087US8026597B2Fluid cooled encapsulated microelectronic packageDELPHI TECH INC·Filed 2008·Granted Sep 27, 2011·10 cites·2 claims
- 2186US9131630B2Edge seal for electronics assembly suitable for exposure to electrically conductive coolantDELPHI TECH INC·Filed 2013·Granted Sep 8, 2015·11 cites·6 claims
- 2286US8471380B2Fluid cooled encapsulated microelectronic packageBRANDENBURG SCOTT D·Filed 2011·Granted Jun 25, 2013·6 cites·4 claims
- 2386US7726972B1Liquid metal rotary connector apparatus for a vehicle steering wheel and columnDELPHI TECH INC·Filed 2009·Granted Jun 1, 2010·17 cites·2 claims
- 2486US7205653B2Fluid cooled encapsulated microelectronic packageDELPHI TECH INC·Filed 2004·Granted Apr 17, 2007·29 cites·8 claims
- 2585US11121058B2Liquid cooled module with device heat spreaderAPTIV TECH LTD·Filed 2019·Granted Sep 14, 2021·3 cites·19 claims
- 2685US7561436B2Circuit assembly with surface-mount IC package and heat sinkDELPHI TECH INC·Filed 2005·Granted Jul 14, 2009·14 cites·4 claims
- 2785US7230832B2Cooled electronic assembly and method for cooling a printed circuit boardDELPHI TECH INC·Filed 2005·Granted Jun 12, 2007·13 cites·20 claims
- 2884US8488321B2Assembly for liquid cooling electronics by direct submersion into circulated engine coolantBRANDENBURG SCOTT D·Filed 2011·Granted Jul 16, 2013·13 cites·14 claims
- 2983US7132746B2Electronic assembly with solder-bonded heat sinkDELPHI TECH INC·Filed 2003·Granted Nov 7, 2006·35 cites·16 claims
- 3083US6833628B2Mutli-chip moduleDELPHI TECH INC·Filed 2002·Granted Dec 21, 2004·33 cites·15 claims
- 3182US11382205B2Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assemblyAPTIV TECH LTD·Filed 2020·Granted Jul 5, 2022·1 cites·20 claims
- 3282US6262489B1Flip chip with backside electrical contact and assembly and method thereforDELPHI TECH INC·Filed 1999·Granted Jul 17, 2001·79 cites·19 claims
- 3378US11095014B2Waveguide antenna with integrated temperature managementAPTIV TECH LTD·Filed 2020·Granted Aug 17, 2021·1 cites·20 claims
- 3477US5770477AFlip chip-on-flip chip multi-chip moduleDELCO ELECTRONICS CORP·Filed 1997·Granted Jun 23, 1998·43 cites·7 claims
- 3576US11737203B2Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assemblyAPTIV TECH LTD·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 3676US5491364AReduced stress terminal pattern for integrated circuit devices and packagesDELCO ELECTRONICS CORP·Filed 1994·Granted Feb 13, 1996·54 cites·17 claims
- 3775US7134194B2Method of developing an electronic moduleDELPHI TECH INC·Filed 2003·Granted Nov 14, 2006·21 cites·10 claims
- 3873US11728576B2Plastic air-waveguide antenna with conductive particlesAPTIV TECH LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 3973US11509035B2Waveguide antenna with integrated temperature managementAPTIV TECH LTD·Filed 2021·Granted Nov 22, 2022·0 cites·15 claims
- 4073US6811892B2Lead-based solder alloys containing copperDELPHI TECH INC·Filed 2002·Granted Nov 2, 2004·19 cites·20 claims
- 4173US6693239B2Overmolded circuit board with underfilled surface-mount component and method thereforDELPHI TECH INC·Filed 2001·Granted Feb 17, 2004·21 cites·34 claims
- 4273US6570260B1Solder process and solder alloy thereforDELPHI TECH INC·Filed 2002·Granted May 27, 2003·13 cites·17 claims
- 4373US5562498AFlexible capacitor filterDELCO ELECTRONICS CORP·Filed 1994·Granted Oct 8, 1996·33 cites·19 claims
- 4472US7364684B2Method of making an encapsulated microelectronic package having fluid carrying encapsulant channelsDELPHI TECH INC·Filed 2004·Granted Apr 29, 2008·9 cites·5 claims
- 4571US11315852B2Thermal interface layer for electronic deviceAPTIV TECH LTD·Filed 2019·Granted Apr 26, 2022·1 cites·18 claims
- 4669US11626345B2Liquid cooled module with device heat spreaderAPTIV TECH LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 4769US2025260170A1Solderable waveguide antennaAptiv Technologies AG·Filed 2025·Application pending·0 cites
- 4868US12315999B2Solderable waveguide antennaAptiv Technologies AG·Filed 2022·Granted May 27, 2025·0 cites·6 claims
- 4968US5774342AElectronic circuit with integrated terminal pinsDELCO ELECTRONICS CORP·Filed 1996·Granted Jun 30, 1998·36 cites·5 claims
- 5066US8797739B2Self circulating heat exchangerBRANDENBURG SCOTT D·Filed 2012·Granted Aug 5, 2014·2 cites·13 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →