Inventor · disambiguated record
Scott Daskiewich
Also filed as: DASKIEWICH SCOTT · DASKIEWICH SCOTT B
5 granted patents·6 pending applications·4 citations·filing 2005–2020
66Inventor score
Top patents by PatentIndex Score
11 records- 0170US9050697B2Self-conditioning polishing pad and a method of making the sameJH RHODES COMPANY INC·Filed 2013·Granted Jun 9, 2015·1 cites·19 claims
- 0267US9440326B2Non-planar glass polishing pad and method of manufactureJH RHODES COMPANY INC·Filed 2013·Granted Sep 13, 2016·2 cites·21 claims
- 0364US9649741B2Polishing material for polishing hard surfaces, media including the material, and methods of forming and using sameJH RHODES COMPANY INC·Filed 2014·Granted May 16, 2017·1 cites·14 claims
- 0459US10092991B2Polymeric lapping materials, media and systems including polymeric lapping material, and methods of forming and using sameJH RHODES COMPANY INC·Filed 2016·Granted Oct 9, 2018·0 cites·20 claims
- 0554US10813444B2Porous polymeric polishing bristles and methods for their manufactureJH RHODES COMPANY INC·Filed 2018·Granted Oct 27, 2020·0 cites·17 claims
- 0648US2020205560A1Porous polymeric polishing bristles and methods for their manufactureJH RHODES COMPANY INC·Filed 2020·Application pending·0 cites
- 0740US2008146129A1Fast break-in polishing pad and a method of making the sameKOUZUMA MAKOTO·Filed 2007·Application pending·0 cites
- 0838US2018134918A1Soft polymer-based material polishing mediaJH RHODES COMPANY INC·Filed 2017·Application pending·0 cites
- 0935US2015258660A1Polyurea-based material, polishing and grinding media including the polyurea-based material, and methods of forming and using sameJH RHODES COMPANY INC·Filed 2015·Application pending·0 cites
- 1032US2006194530A1Polishing pad for use in polishing work piecesTHOMSON CLIFFORD O·Filed 2005·Application pending·0 cites
- 1130US2007049164A1Polishing pad and method for manufacturing polishing padsTHOMSON CLIFFORD O·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →