Inventor · disambiguated record
Scott Kirkman
Also filed as: KIRKMAN SCOTT · KIRKMAN SCOTT L · KIRKMAN SCOTT LEE
11 granted patents·3 pending applications·479 citations·filing 1992–2023
92Inventor score
Top patents by PatentIndex Score
14 records- 0192US5903050ASemiconductor package having capacitive extension spokes and method for making the sameLSI LOGIC CORP·Filed 1998·Granted May 11, 1999·181 cites·8 claims
- 0291US6064113ASemiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedancesLSI LOGIC CORP·Filed 1998·Granted May 16, 2000·118 cites·16 claims
- 0387US11784215B2Deep trench capacitors embedded in package substrateGOOGLE LLC·Filed 2020·Granted Oct 10, 2023·2 cites·21 claims
- 0487US6137168ASemiconductor package with traces routed underneath a dieLSI LOGIC CORP·Filed 1999·Granted Oct 24, 2000·84 cites·4 claims
- 0585US7007741B2Conformal heat spreaderSUN MICROSYSTEMS INC·Filed 2002·Granted Mar 7, 2006·43 cites·4 claims
- 0675US12274079B2Deep trench capacitors embedded in package substrateGOOGLE LLC·Filed 2023·Granted Apr 8, 2025·0 cites·23 claims
- 0769US10892316B2High density ball grid array (BGA) package capacitor designGOOGLE LLC·Filed 2019·Granted Jan 12, 2021·1 cites·18 claims
- 0859US2025046516A1Capacitor Carrier Ring And Stiffener For Integrated Circuit Package AssemblyGOOGLE LLC·Filed 2023·Application pending·0 cites
- 0950US5793104AApparatus for forming electrical connections between a semiconductor die and a semiconductor packageLSI LOGIC CORP·Filed 1996·Granted Aug 11, 1998·14 cites·17 claims
- 1050US5337614AFixture for testing mounting integrity of heat sinks on semiconductor packages, and method of testingLSI LOGIC CORP·Filed 1992·Granted Aug 16, 1994·15 cites·11 claims
- 1145US5911112AMethod for forming electrical connections between a semiconductor die and a semiconductor packageLSI LOGIC CORP·Filed 1997·Granted Jun 8, 1999·11 cites·29 claims
- 1244US2007080441A1Thermal expansion compensation graded IC packageKIRKMAN SCOTT·Filed 2005·Application pending·0 cites
- 1341US5992012AMethod for making electrical interconnections between layers of an IC packageLSI LOGIC CORP·Filed 1997·Granted Nov 30, 1999·10 cites·19 claims
- 1437US2003170972A1Dynamic solder attachFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →