Inventor · disambiguated record
Scott Mcgrath
Also filed as: MCGRATH SCOTT · MCGRATH SCOTT P
21 granted patents·7 pending applications·190 citations·filing 2008–2022
94Inventor score
Top patents by PatentIndex Score
28 records- 0194US8684092B2System and method for providing additional blowout preventer control redundancyTRANSOCEAN SEDCO FOREX VENTURES LTD·Filed 2013·Granted Apr 1, 2014·15 cites·9 claims
- 0294US7923349B2Wafer level surface passivation of stackable integrated circuit chipsVERTICAL CIRCUITS INC·Filed 2008·Granted Apr 12, 2011·37 cites·25 claims
- 0393US8723332B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2008·Granted May 13, 2014·35 cites·38 claims
- 0493US8629543B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2010·Granted Jan 14, 2014·19 cites·29 claims
- 0592US8376051B2System and method for providing additional blowout preventer control redundancyMCGRATH SCOTT P·Filed 2008·Granted Feb 19, 2013·39 cites·11 claims
- 0684US10254386B1Waveform modelHEWLETT PACKARD ENTPR DEV LP·Filed 2017·Granted Apr 9, 2019·4 cites·18 claims
- 0784US8704379B2Semiconductor die mount by conformal die coatingCRANE SCOTT JAY·Filed 2008·Granted Apr 22, 2014·14 cites·12 claims
- 0878US9825002B2Flipped die stackINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·3 cites·12 claims
- 0976US9153517B2Electrical connector between die pad and z-interconnect for stacked die assembliesCO REYNALDO·Filed 2011·Granted Oct 6, 2015·5 cites·19 claims
- 1074US10062099B2Product identification based on location associated with image of productARUBA NETWORKS INC·Filed 2014·Granted Aug 28, 2018·5 cites·20 claims
- 1173US8912661B2Stacked die assembly having reduced stress electrical interconnectsMCGRATH SCOTT·Filed 2010·Granted Dec 16, 2014·5 cites·24 claims
- 1271US9508689B2Electrical connector between die pad and z-interconnect for stacked die assembliesINVENSAS CORP·Filed 2015·Granted Nov 29, 2016·2 cites·18 claims
- 1371US9252116B2Semiconductor die mount by conformal die coatingINVENSAS CORP·Filed 2014·Granted Feb 2, 2016·2 cites·15 claims
- 1470US2023077846A1Water heater and boiler processesAERCO INT INC·Filed 2022·Application pending·0 cites
- 1567US9824999B2Semiconductor die mount by conformal die coatingINVENSAS CORP·Filed 2015·Granted Nov 21, 2017·1 cites·17 claims
- 1667US8324081B2Wafer level surface passivation of stackable integrated circuit chipsMCELREA SIMON J S·Filed 2011·Granted Dec 4, 2012·2 cites·9 claims
- 1765US11549681B2Water heater and boiler processesAERCO INT INC·Filed 2020·Granted Jan 10, 2023·0 cites·8 claims
- 1864US9503915B2Dynamic beamforming configuration based on network conditionsARUBA NETWORKS INC·Filed 2013·Granted Nov 22, 2016·1 cites·21 claims
- 1959US9438496B2Monitoring link quality between network devicesARUBA NETWORKS INC·Filed 2013·Granted Sep 6, 2016·1 cites·18 claims
- 2047US8742602B2Vertical electrical interconnect formed on support prior to die mountCASKEY TERRENCE·Filed 2008·Granted Jun 3, 2014·0 cites·20 claims
- 2147US2010140811A1Semiconductor die interconnect formed by aerosol application of electrically conductive materialVERTICAL CIRCUITS INC·Filed 2009·Application pending·0 cites
- 2245US2009068790A1Electrical Interconnect Formed by Pulsed DispenseVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 2345US2008315407A1Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabricationVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 2445US2009102038A1Chip scale stacked die packageVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 2542US2015117322A1Policy-Based Control Mechanism For Wireless Network Physical Layer ResourcesARUBA NETWORKS INC·Filed 2013·Application pending·0 cites
- 2641US2013119117A1Bonding wedgeINVENSAS CORP·Filed 2012·Application pending·0 cites
- 2738US9859234B2Methods and structures to repair device warpageINVENSAS CORP·Filed 2015·Granted Jan 2, 2018·0 cites·12 claims
- 2836US9659848B1Stiffened wires for offset BVAINVENSAS CORP·Filed 2016·Granted May 23, 2017·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →