Inventor · disambiguated record
Scott A. Sikorski
Also filed as: SIKORSKI SCOTT A
2 granted patents·63 citations·filing 1991–1996
66Inventor score
Files withIBM2
Top patents by PatentIndex Score
2 records- 0169US5831810AElectronic component package with decoupling capacitors completely within die receiving cavity of substrateIBM·Filed 1996·Granted Nov 3, 1998·41 cites·17 claims
- 0250US5304284AMethods for etching a less reactive material in the presence of a more reactive materialIBM·Filed 1991·Granted Apr 19, 1994·22 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →