Inventor · disambiguated record
Seokgeun Ahn
Also filed as: AHN SEOKGEUN
3 granted patents·12 pending applications·0 citations·filing 2020–2025
49Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD15
Top patents by PatentIndex Score
15 records- 0171US12308345B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 0264US11984426B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·10 claims
- 0358US2024413026A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0457US2024421140A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0556US11424218B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 0656US2025183242A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0756US2025062304A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0854US2024136341A1Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0951US2024063103A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1050US2024021577A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1150US2024170440A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1249US2024170358A1Semiconductor packages having heat dissipation pillarsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1348US2024014086A1Semiconductor package and method for manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1442US2025239577A1Chip structure including optical integrated circuit chip, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1538US2025284073A1Chip structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →