Inventor · disambiguated record

Seung Ahn

Also filed as: AHN SEUNG CHUL · AHN SEUNG-CHUI

1 granted patent·1 pending application·11 citations·filing 1999–2002

33Inventor score

Technology areasH10P H10W

Files withSAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

2 records

0137US6337221B1Die bonding method for manufacturing fine pitch ball grid array packagesSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jan 8, 2002·11 cites·15 claims
0230US2003145939A1Dual die bonder for a semiconductor device and a method thereofFiled 2002·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →