Inventor · disambiguated record
Seungdo An
Also filed as: AN SEUNGDO
3 granted patents·1 pending application·0 citations·filing 2016–2021
43Inventor score
Top patents by PatentIndex Score
4 records- 0159US11652045B2Via contact patterning method to increase edge placement error marginINTEL CORP·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 0252US11211324B2Via contact patterning method to increase edge placement error marginINTEL CORP·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 0346US2023143021A1Integrated circuit interconnect structures including copper-free viasINTEL CORP·Filed 2021·Application pending·0 cites
- 0433US10794374B2Microfabricated gas flow structureUNIV MICHIGAN REGENTS·Filed 2016·Granted Oct 6, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →