Inventor · disambiguated record
Seungduk Baek
Also filed as: BAEK SEUNGDUK
14 granted patents·24 pending applications·23 citations·filing 2009–2025
87Inventor score
Top patents by PatentIndex Score
38 records- 0191US9165916B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 20, 2015·14 cites·13 claims
- 0286US12347819B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·1 cites·20 claims
- 0386US11495576B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·19 claims
- 0482US11721604B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·2 cites·20 claims
- 0580US11257725B2Semiconductor package including test bumpsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·1 cites·20 claims
- 0679US11721601B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·1 cites·21 claims
- 0776US10847447B2Semiconductor device having planarized passivation layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 24, 2020·2 cites·20 claims
- 0876US2025336855A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0970US2025286036A1Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1067US12368119B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 1167US12154881B2Integrated circuit device having redistribution patternSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·15 claims
- 1265US12438064B2Semiconductor package with bonding interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 1364US12125753B2Semiconductor package including test bumpsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 1462US11488894B2Semiconductor device having planarized passivation layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 1559US2025293108A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1658US2025149444A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1758US2025149430A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1858US2024194648A1Stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1956US2024055372A1Highly integrated semiconductor device containing multiple bonded diesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2056US2024096717A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2156US2024030074A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2256US2024421129A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2356US2024072003A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2456US2025029895A1Semiconductor stacked structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2556US2024421125A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2655US11640951B2Integrated circuit device having redistribution patternSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 2, 2023·0 cites·20 claims
- 2754US2024234373A9Memory device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2854US2023378110A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2953US2024153898A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3052US2025069972A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3150US2024153886A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3249US2023086202A1Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3347US2012043125A1Circuit boards, methods of forming the same and semiconductor packages including the sameKIM TAEHOON·Filed 2011·Application pending·0 cites
- 3446US2010096754A1Semiconductor package, semiconductor module, and method for fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3545US2022302087A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 3644US2023005883A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3741US2021143126A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 3836US9646895B2Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 9, 2017·0 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Seungduk Baek files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →