Inventor · disambiguated record
Seung Joo Baek
Also filed as: BAEK SEUNG JOO
9 granted patents·2 pending applications·12 citations·filing 2006–2025
81Inventor score
Top patents by PatentIndex Score
11 records- 0178US7871887B2Semiconductor device with reduced resistance of bit lines and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Jan 18, 2011·6 cites·23 claims
- 0270US8853018B2Method of manufacturing semiconductor device having multi-channelsSK HYNIX INC·Filed 2012·Granted Oct 7, 2014·3 cites·19 claims
- 0358US2025382706A1Deposition source and electronic deviceSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0457US7803689B2Semiconductor device manufactured with a double shallow trench isolation processHYNIX SEMICONDUCTOR INC·Filed 2009·Granted Sep 28, 2010·1 cites·31 claims
- 0556US7608878B2Semiconductor device manufactured with a double shallow trench isolation processHYNIX SEMICONDUCTOR INC·Filed 2006·Granted Oct 27, 2009·1 cites·6 claims
- 0654US8106450B2Semiconductor device having a saddle fin shaped gate and method for manufacturing the sameBAEK SEUNG JOO·Filed 2009·Granted Jan 31, 2012·1 cites·2 claims
- 0752US9142678B2Semiconductor device having fin structure and method of manufacturing the sameSK HYNIX INC·Filed 2014·Granted Sep 22, 2015·0 cites·8 claims
- 0849US8772110B2Semiconductor device having fin structure and method of manufacturing the sameSK HYNIX INC·Filed 2012·Granted Jul 8, 2014·0 cites·13 claims
- 0948US8361864B2Semiconductor device having a saddle fin shaped gate and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2011·Granted Jan 29, 2013·0 cites·17 claims
- 1046US7537986B2Semiconductor device and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2006·Granted May 26, 2009·0 cites·13 claims
- 1142US2008023754A1Semiconductor device with a wave-shaped trench or gate and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →