Inventor · disambiguated record
Seunghyun Baik
Also filed as: BAIK SEUNGHYUN
8 granted patents·4 pending applications·24 citations·filing 2005–2024
78Inventor score
Top patents by PatentIndex Score
12 records- 0189US8765488B2Sensors employing single-walled carbon nanotubesSTRANO MICHAEL S·Filed 2005·Granted Jul 1, 2014·19 cites·29 claims
- 0278US10712347B2Sensors employing single-walled carbon nanotubesUNIV ILLINOIS·Filed 2014·Granted Jul 14, 2020·3 cites·22 claims
- 0373US10916533B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·2 cites·19 claims
- 0461US2025192129A1Semiconductor package including a composite spacerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0557US2024395755A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0656US12362318B2Semiconductor package comprising semiconductor chip with stepped portionSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·19 claims
- 0756US11948913B2Semiconductor package including a dummy padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 0855US2024355777A1Packaged integrated circuit devices with enhanced dam structures that provide increased yield and reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0953US2024100634A1Lead-free solder alloy composition, solder ball including the same, solder paste including the lead-free solder alloy composition, semiconductor device including hybrid bonding structure including the lead-free solder alloy composition, and method of manufacturing solder paste including the lead-free solder alloy compositionSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1047US11581290B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·16 claims
- 1141US10136854B2Stretchable thermoelectric material and thermoelectric device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 27, 2018·0 cites·8 claims
- 1233US10210965B2Method for electrical contact materials including Ag plated CNTsLSIS CO LTD·Filed 2016·Granted Feb 19, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →