Inventor · disambiguated record
Sebastian Brunner
Also filed as: BRUNNER SEBASTIAN
20 granted patents·5 pending applications·53 citations·filing 2004–2024
92Inventor score
Top patents by PatentIndex Score
25 records- 0188US11088090B1Package comprising a substrate that includes a stress buffer layerQUALCOMM INC·Filed 2020·Granted Aug 10, 2021·7 cites·23 claims
- 0287US12341488B2Package comprising an acoustic device and a polymer cap layerQUALCOMM INC·Filed 2022·Granted Jun 24, 2025·2 cites·30 claims
- 0387US9230719B2Method for producing an electrical component, and electrical componentFEICHTINGER THOMAS·Filed 2012·Granted Jan 5, 2016·8 cites·15 claims
- 0479US9337408B2Light-emitting diode deviceEPCOS AG·Filed 2013·Granted May 10, 2016·3 cites·20 claims
- 0577US7928558B2Production of an electrical component and componentEPCOS AG·Filed 2005·Granted Apr 19, 2011·7 cites·19 claims
- 0677US7710710B2Electrical component and circuit configuration with the electrical componentEPCOS AG·Filed 2005·Granted May 4, 2010·10 cites·27 claims
- 0767US9449958B2Light-emitting diode deviceEPCOS AG·Filed 2013·Granted Sep 20, 2016·2 cites·14 claims
- 0863US8415251B2Electric component and component and method for the production thereofBRUNNER SEBASTIAN·Filed 2011·Granted Apr 9, 2013·1 cites·21 claims
- 0960US9865381B2Chip with protection function and method for producing sameEPCOS AG·Filed 2015·Granted Jan 9, 2018·1 cites·15 claims
- 1059US9287247B2Light-emitting diode arrangement, module, and method for producing a light-emitting diode arrangementEPCOS AG·Filed 2013·Granted Mar 15, 2016·1 cites·20 claims
- 1156US7710233B2Electric multilayer componentEPCOS AG·Filed 2004·Granted May 4, 2010·10 cites·29 claims
- 1254US11450598B2Package including a substrate with high resolution rectangular cross-section interconnectsQUALCOMM INC·Filed 2020·Granted Sep 20, 2022·0 cites·26 claims
- 1352US8413321B2Module substrate and production methodBRUNNER SEBASTIAN·Filed 2010·Granted Apr 9, 2013·1 cites·20 claims
- 1452US2025379557A1Acoustic filter device including an acoustic filter and one or more integrated passive devicesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1550US10278285B2Electric component assemblyEPCOS AG·Filed 2013·Granted Apr 30, 2019·0 cites·8 claims
- 1645US2009174054A1Module with Flat Construction and Method for Placing ComponentsBLOCK CHRISTIAN·Filed 2009·Application pending·0 cites
- 1744US10090454B2Method for producing an electric contact connection of a multilayer componentEPCOS AG·Filed 2013·Granted Oct 2, 2018·0 cites·8 claims
- 1842US10490322B2Component carrier having an ESD protective function and method for producing sameEPCOS AG·Filed 2017·Granted Nov 26, 2019·0 cites·14 claims
- 1941US10117329B2Carrier plate, device having the carrier plate and method for producing a carrier plateSNAPTRACK INC·Filed 2013·Granted Oct 30, 2018·0 cites·15 claims
- 2041US2011148546A1Multilayer ComponentFEICHTINGER THOMAS·Filed 2011·Application pending·0 cites
- 2138US2007271782A1Electrical Multilayer Component with Solder ContactBLOCK CHRISTIAN·Filed 2005·Application pending·0 cites
- 2237US11239010B2Component substrate having a protective functionEPCOS AG·Filed 2016·Granted Feb 1, 2022·0 cites·9 claims
- 2335US10818641B2Multi-LED systemEPCOS AG·Filed 2017·Granted Oct 27, 2020·0 cites·12 claims
- 2432US9001523B2Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layerBRUNNER SEBASTIAN·Filed 2010·Granted Apr 7, 2015·0 cites·13 claims
- 2532US2017311455A1Method for Producing a Multi-Layer Substrate and Multi-Layer SubstrateEPCOS AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →