Inventor · disambiguated record
Seung-Jin Cheon
Also filed as: CHEON SEUNG JIN
1 granted patent·4 pending applications·1 citations·filing 2007–2020
16Inventor score
Top patents by PatentIndex Score
5 records- 0141US7824585B2Apparatus and method for fabricating semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 2, 2010·1 cites·17 claims
- 0237US2013161800A1Pcb for muf and molding structure of the pcbSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 0330US2021108009A1Method for producing alicyclic acrylate derivativeSONGWON IND CO LTD·Filed 2020·Application pending·0 cites
- 0427US2017129032A1Ball box and solder ball attachment apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 0526US2017136669A1Molding apparatus for semiconductor package fabrication and method of molding semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →