Inventor · disambiguated record
Seungjin Cheon
Also filed as: CHEON SEUNGJIN
4 granted patents·11 citations·filing 2013–2021
66Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0180US8981543B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 17, 2015·7 cites·17 claims
- 0276US9881814B2Apparatus for manufacturing semiconductor package and method for manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 30, 2018·4 cites·19 claims
- 0356US11776946B2Method of manufacturing package-on-package device and bonding apparatus used thereinSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·19 claims
- 0446US10998303B2Method of manufacturing package-on-package device and bonding apparatus used thereinSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 4, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →