Inventor · disambiguated record
Seongkeun Cho
Also filed as: CHO Seongkeun
9 granted patents·7 pending applications·1 citations·filing 2017–2025
75Inventor score
Files withSAMSUNG ELECTRONICS CO LTD16
Top patents by PatentIndex Score
16 records- 0182US11955387B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 9, 2024·1 cites·10 claims
- 0280US2025359022A1Semiconductor memory device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0377US2025380401A1Semiconductor Memory Device And Method For Manufacturing The SameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0473US12224214B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·10 claims
- 0570US12408323B2Semiconductor memory device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 0670US11862457B2Wafer cleaning apparatus, method for cleaning wafer and method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 2, 2024·0 cites·15 claims
- 0765US2025234502A1Semiconductor devices including contact plug and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0864US12402302B2Semiconductor memory device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 0962US11581182B2Wafer cleaning apparatus, method for cleaning wafer and method for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·18 claims
- 1061US2024381616A1Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1159US12482690B2Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 1259US2025194110A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1355US2025240958A1Integrated circuit devices having reflective structures therein that enhance device yield and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1445US11996270B2Wafer processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 28, 2024·0 cites·16 claims
- 1538US10401301B2Optical test system and method, and method of manufacturing semiconductor device by using the optical test system and methodSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·20 claims
- 1637US2018073979A1Defect inspection system, method of inspecting defects, and method of fabricating semiconductor device using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →