Inventor · disambiguated record
Sebin Choi
Also filed as: CHOI SEBIN
3 granted patents·3 pending applications·7 citations·filing 2020–2024
56Inventor score
Top patents by PatentIndex Score
6 records- 0192US11607741B2Semiconductor chip bonding apparatus including head having thermally conductive materialsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 21, 2023·7 cites·20 claims
- 0268US11848301B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 19, 2023·0 cites·20 claims
- 0360US11626381B2Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 0459US2025128215A1Gas mixerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0554US2024424457A1Gas mixing device, substrate processing system including the same, and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0651US2024271282A1Source gas nozzle and semiconductor wafer processing apparatus including the sameSUMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →