Inventor · disambiguated record
Seongryul Choi
Also filed as: CHOI SEONGRYUL
1 granted patent·9 pending applications·3 citations·filing 2017–2024
21Inventor score
Files withQUALCOMM INC10
Top patents by PatentIndex Score
10 records- 0177US10157824B2Integrated circuit (IC) package and package substrate comprising stacked viasQUALCOMM INC·Filed 2017·Granted Dec 18, 2018·3 cites·31 claims
- 0257US2025379162A1Hybrid dtc embedding substrateQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0356US2025300050A1Package substrateQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0452US2025239508A1Interposer substrate with integrated step die cavity, and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0552US2024373560A1Package substrate having embedded electronic component mounted on core of the package substrateQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0651US2024250009A1EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH REDUCED-WIDTH EMBEDDED METAL TRACES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODSQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0749US2024373561A1Substrate having electronic component mounted in a cavity of a core using a plugging ink and method for making the substrateQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0847US2023114404A1Embedded trace substrate (ets) with embedded metal traces having multiple thickness for integrated circuit (ic) package height controlQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0943US2023215849A1PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPACITOR(S) (DTC(s)), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODSQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1034US2021057397A1Electrodeless passive embedded substrateQUALCOMM INC·Filed 2019·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Seongryul Choi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →