Inventor · disambiguated record
Seungweon Ha
Also filed as: HA SEUNGWEON
2 granted patents·0 citations·filing 2017–2022
23Inventor score
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0146US12414297B2Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0243US10658326B2Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 19, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →