Inventor · disambiguated record
Seung-Ho Hahn
Also filed as: HAHN SEUNG-HO
6 granted patents·2 pending applications·78 citations·filing 2000–2025
81Inventor score
Files withHYNIX SEMICONDUCTOR INC2HYUNDAI ELECTRONICS IND2DONGBU ELECTRONICS CO LTD1DONGBUANAM SEMICONDUCTOR INC1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
8 records- 0184US6599803B2Method for fabricating semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Jul 29, 2003·37 cites·6 claims
- 0274US6368925B2Method of forming an EPI-channel in a semiconductor deviceHYUNDAI ELECTRONICS IND·Filed 2001·Granted Apr 9, 2002·20 cites·20 claims
- 0362US6482717B1Method of manufacturing a semiconductor device including forming well comprising EPI in trenchHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Nov 19, 2002·13 cites·20 claims
- 0459US6500719B1Method of manufacturing a MOSFET of an elevated source/drain structure with SEG in facetHYUNDAI ELECTRONICS IND·Filed 2000·Granted Dec 31, 2002·8 cites·11 claims
- 0551US2025385215A1Hybrid bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0637US6958299B2Methods of manufacturing semiconductor devicesDONGBUANAM SEMICONDUCTOR INC·Filed 2003·Granted Oct 25, 2005·0 cites·14 claims
- 0733US2001040292A1Semiconductor device having a contact plug formed by a dual epitaxial layer and method for fabricating the sameFiled 2001·Application pending·0 cites
- 0832US6794233B2Methods of fabricating a MOSFETDONGBU ELECTRONICS CO LTD·Filed 2003·Granted Sep 21, 2004·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →