Inventor · disambiguated record
Seung Jin Han
Also filed as: HAN SEUNG JIN
7 granted patents·5 pending applications·4 citations·filing 2019–2024
72Inventor score
Top patents by PatentIndex Score
12 records- 0188US11639653B2Systems and methods for simultaneously fracturing multiple wells from a common wellpadCHEVRON USA INC·Filed 2021·Granted May 2, 2023·4 cites·20 claims
- 0276US12421446B2Carbon dioxide sequestered proppants for well stimulationCHEVRON USA INC·Filed 2024·Granted Sep 23, 2025·0 cites·19 claims
- 0370US12110455B2Carbon dioxide sequestered proppants for well stimulationCHEVRON USA INC·Filed 2022·Granted Oct 8, 2024·0 cites·8 claims
- 0469US2024336808A1Method of preparing polymer film, polymer film, substrate for display device, and optical device using the sameLG CHEMICAL LTD·Filed 2023·Application pending·0 cites
- 0568US2024279510A1Polymer resin composition, method of preparing polymer film, polymer film, substrate for display device, and optical device using the sameLG CHEMICAL LTD·Filed 2023·Application pending·0 cites
- 0666US2024012560A1Infusion pump touchscreen with false touch rejectionICU MEDICAL INC·Filed 2023·Application pending·0 cites
- 0765US11775166B2Infusion pump touchscreen with false touch rejectionICU MEDICAL INC·Filed 2022·Granted Oct 3, 2023·0 cites·24 claims
- 0864US12049809B2Systems and methods for simultaneously fracturing multiple wells from a common wellpadCHEVRON USA INC·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 0960US2024397768A1Display DeviceLG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 1046US2023392478A1Partitioning High Pressure Pumps At A Well SiteCHEVRON USA INC·Filed 2023·Application pending·0 cites
- 1145US12509978B2Systems and methods for simultaneously and independently fracturing multiple wells from a common wellpadCHEVRON USA INC·Filed 2024·Granted Dec 30, 2025·0 cites·20 claims
- 1243US11393081B2Method and apparatus for processing thermal imageHANWHA TECHWIN CO LTD·Filed 2019·Granted Jul 19, 2022·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →