Inventor · disambiguated record

Seong-Jae Heo

Also filed as: HEO SEONG-JAE

1 granted patent·1 pending application·30 citations·filing 2000–2002

46Inventor score

Technology areasH10W

Files withHYUNDAI ELECTRONICS IND1 LG SEMICON CO LTD1

Top patents by PatentIndex Score

2 records

0177US6484394B1Encapsulation method for ball grid array semiconductor packageHYUNDAI ELECTRONICS IND·Filed 2000·Granted Nov 26, 2002·30 cites·14 claims
0233US2002148112A1Encapsulation method for ball grid array semiconductor packageLG SEMICON CO LTD·Filed 2002·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →