Inventor · disambiguated record
Seungman Hong
Also filed as: HONG SEUNGMAN
0 granted patents·2 pending applications·0 citations·filing 2022–2024
Technology areasH10W
Files withSTATS CHIPPAC PTE LTD2
Top patents by PatentIndex Score
2 records- 0160US2024371720A1Semiconductor package and method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0253US2024047386A1Semiconductor Device and Method of Forming Hybrid Substrate with IPD Over Active Semiconductor WaferSTATS CHIPPAC PTE LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →