Inventor · disambiguated record
Seung-Chul Hong
Also filed as: HONG SEUNG CHUL
22 granted patents·10 pending applications·40 citations·filing 2001–2024
91Inventor score
Files withSK ENPULSE CO LTD13MAXLINEAR INC6HONG SEUNG-CHUL3KOREA ELECTRONICS TELECOMM2SAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
32 records- 0179US7136410B2Adaptive interference suppression receiving apparatus for space-time block coded direct sequence/code division multiple access communication systemKOREA ELECTRONICS TELECOMM·Filed 2002·Granted Nov 14, 2006·21 cites·12 claims
- 0270US9392547B2Diversity receiverHONG SEUNG-CHUL·Filed 2011·Granted Jul 12, 2016·4 cites·20 claims
- 0369US9391767B2Apparatus and methods for symbol timing error detection, tracking and correctionMAXLINEAR INC·Filed 2015·Granted Jul 12, 2016·1 cites·18 claims
- 0469US7039094B2Adaptive rake receiving apparatus constrained with at least one constraint for use in mobile communication system and method thereforKOREA ELECTRONICS TELECOMM·Filed 2001·Granted May 2, 2006·11 cites·20 claims
- 0567US12441911B2Composition for semiconductor processing and polishing method of semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·16 claims
- 0665US9231685B2Diversity blocker protectionHONG SEUNG-CHUL·Filed 2010·Granted Jan 5, 2016·2 cites·18 claims
- 0759US12480021B2Composition for semiconductor process, method for preparing the same and method for preparing semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·13 claims
- 0859US12116503B2Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the sameSK ENPULSE CO LTD·Filed 2022·Granted Oct 15, 2024·0 cites·19 claims
- 0958US12444611B2Semiconductor process polishing composition and polishing method of substrate applied with polishing compositionSK ENPULSE CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·13 claims
- 1058US10218459B2Apparatus and methods for symbol timing error detection, tracking and correctionMAXLINEAR INC·Filed 2017·Granted Feb 26, 2019·0 cites·18 claims
- 1157US2024274439A1Polishing composition for semiconductor process and method for polishing a substrate using the sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1256US12448543B2Polishing composition for semiconductor process and manufacturing method for polished articleSK ENPULSE CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·13 claims
- 1356US10425262B2Method and system for adaptive guard interval (GI) combiningMAXLINEAR INC·Filed 2018·Granted Sep 24, 2019·0 cites·20 claims
- 1456US9641377B2Apparatus and methods for symbol timing error detection, tracking and correctionMAXLINEAR INC·Filed 2016·Granted May 2, 2017·0 cites·18 claims
- 1556US9020054B2Apparatus and methods for symbol timing error detection, tracking and correctionMAXLINEAR INC·Filed 2013·Granted Apr 28, 2015·0 cites·14 claims
- 1652US2024218251A1Polishing composition for semiconductor processing and method of polishing a substrateSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1752US2023407135A1Composition for semiconductor processing and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Application pending·0 cites
- 1850US8548075B2Apparatus and methods for symbol timing error detection, tracking and correctionHONG SEUNG-CHUL·Filed 2010·Granted Oct 1, 2013·0 cites·34 claims
- 1949US12486428B2Polishing pad and method for manufacturing semiconductor device using sameSK ENPULSE CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·13 claims
- 2048US12110421B2Composition for semiconductor processing and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·13 claims
- 2148US10063399B2Method and system for adaptive guard interval (GI) combiningMAXLINEAR INC·Filed 2015·Granted Aug 28, 2018·0 cites·26 claims
- 2248US2022325139A1Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 2347US12444616B2Polishing composition for semiconductor processing polishing composition preparation method, and semiconductor device manufacturing method to which polishing composition is appliedSK ENPULSE CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·10 claims
- 2447US7882403B2Apparatus and method for controlling an interleaver/deinterleaver memory in a mobile communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 1, 2011·1 cites·19 claims
- 2546US9014103B2Method and apparatus for transmitting/receiving preamble of random access channel in a broadband wireless communication systemMOON HI-CHAN·Filed 2007·Granted Apr 21, 2015·0 cites·13 claims
- 2646US2023332014A1Polishing compostion for semiconductor process, manufacturing method of polishing composition and method for manufacturing semiconductor device by using the sameSK ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 2746US2024043718A1Polishing composition for semiconductor processing,method for preparing polishing composition, and method for manufacturing semiconductor element to which polishing composition is appliedSK ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 2845US9042463B2Method and system for adaptive guard interval (GI) combiningZHU MINGRUI·Filed 2012·Granted May 26, 2015·0 cites·13 claims
- 2945US2024043719A1Polishing composition for semiconductor processing,method for preparing polishing composition, and method for manufacturing semiconductor element to which polishing composition is appliedSKC ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 3043US2007237117A1Apparatus and method for transmitting message in a mobile communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3134US2007047623A1Method and apparatus for generating a pseudorandom binary sequence using a linear feedback shift registerEUN YOO-CHANG·Filed 2006·Application pending·0 cites
- 3232US2017183537A1Polishing slurry compositionK C TECH CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →